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Adhesives Ingredients
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Adhesives Ingredients
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Products Compatible with Kowa PEMP

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
370 products match your search
Product Name
Supplier
Description
Bruno Bock chemische Fabrik
HSP Distance: 0.5
Glycol di (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMP is solvent free and exhibits high reactivity, low viscosity as well as low... view more
HSP Distance: 0.6
Kowa DPMP is a dipentaerythritol-hexakis-(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
Bruno Bock chemische Fabrik
HSP Distance: 0.7
Trimethylolpropane trimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMA is solvent free and exhibits high reactivity, low viscosity as well as... view more
Kyoeisha Chemical
HSP Distance: 0.8
2-(Acryloyloxy) ethyl 2-hydroxyethyl phthalate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Nagase Specialty Materials
HSP Distance: 0.8
NAM- HOAMPE by Nagase Specialty Materials is a 2-acryloyloxy ethyl 2-hydroxy ethyl phthalate. Offers good flexibility. It is registered in TSCA... view more
Lanxess
HSP Distance: 1.0
Solbrol® A by Lanxess is ethylparaben-based highly effective in-can preservative in adhesives and animal, plant and synthetic glues. Solbrol® A can be used in connection with other preservatives... view more
Applications
Ningbo Actmix Polymer
HSP Distance: 1.2
Actmix® HMMM-50GE F140 is a hexamethoxy methyl melamine. Acts as an adhesion promoter. It is an adhesive of rubber and framework materials due to reactions with methylene acceptor at vulcanizing... view more
Bruno Bock chemische Fabrik
HSP Distance: 1.5
Glycol dimercaptoacetate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® GDMA is solvent free and exhibits high reactivity, low viscosity as well as low color. It... view more
HSP Distance: 1.6
Kowa MHHPA is a methyl hexa hydro phthalic anhydride monomer. Used in adhesives... view more
Lanxess
HSP Distance: 1.6
Solbrol® P by Lanxess is paraben-n-propylester-based preservative. Solbrol® P is used in the manufacture of glues and adhesives... view more
Applications
HSP Distance: 1.6
Solbrol® P Sodium Salt by Lanxess is used as a preservative in the manufacturing of glues and adhesives. Solbrol® P Sodium Salt is a paraben-n-propylester sodium salt... view more
New Japan Chemical
HSP Distance: 1.6
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 1.6
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It... view more
New Japan Chemical
HSP Distance: 1.6
4-methylhexahydrophthalic anhydride. Acts as an epoxy resin hardener/curing agent. It is a clear and colorless liquid. It has high heat resistance, chemical resistance and electric insulation. It is... view more
HSP Distance: 1.8
FILMGUARD™ IPBC 100 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications... view more
HSP Distance: 1.8
FILMGUARD™ IPBC 20 by Dow is a broad spectrum, fungicidal agent. It is used in flooring adhesives & carpet backings and sealants. FILMGUARD™ IPBC 20 provides protection from fungal attack in... view more
HSP Distance: 1.8
FILMGUARD™ IPBC 40 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications. FILMGUARD™... view more
HSP Distance: 1.8
Solbrol® ICG by Lanxess is an in-can preservative in adhesives and animal, plant and synthetic glues. It is 3-iodo-2-propynylbutylcarbamate (IPBC). It offers efficiency against mold fungi, yeast and... view more
Applications
HSP Distance: 1.8
Omacide™ IPBC 100 Fungicide by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. It is a broad spectrum antimicrobial additive, preventing dry film fungal growth such as yeast and molds... view more
HSP Distance: 1.8
Omacide™ IPBC 20 by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants... view more
HSP Distance: 1.8
Omacide™ IPBC 30 by Lonza is an iodopropynyl butyl carbamate (IPBC) grade. Broad spectrum fungicide additive. Prevents dry film fungal growth. Irreversible yellowing of the dry film may occur soon... view more
HSP Distance: 1.8
Omacide™ IPBC 30 DPG by Lonza is iodopropynyl butyl carbamate (IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is designed for adhesives, caulks and... view more
HSP Distance: 1.8
Omacide™ IPBC 40 by Lonza is iodopropynyl butyl carbamate(IPBC). It is a broad-spectrum fungicide additive. It prevents dry film fungal growth. It is used in adhesives, caulks and sealants. Omacide™... view more
A&C Catalysts
HSP Distance: 1.9
Technicure® IPDU-8 by A&C Catalysts is a N-3-(dimethylamino) carbonylaminomethyl-3,5,5-trimethylcyclohexyl-N,N-dimethyl-urea, is a substituted urea. Technicure® IPDU-8 is a dicyandiamide (DICY) cure... view more
HSP Distance: 1.9
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature... view more
Lambiotte & Cie
HSP Distance: 1.9
1,3-dioxacyclopentane. It acts as a solvent. It is produced by reactions between alcohols and aldehydes. It shows very good profiles for health and environment with regard to toxicity and... view more
HSP Distance: 2.0
Tris (4-aminophenyl) thiophosphate . It is a multifunctional monomer specifically developed for PU. Imparts inherent flame retardency due to presence of P, N and S elements... view more
New Japan Chemical
HSP Distance: 2.0
Methylbicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride. Acts as an epoxy resin hardner/curing agent. It is a clear and colorless liquid. It provides heat-resistance and produces products that are... view more
A&C Catalysts
HSP Distance: 2.1
Resicure™ 2-MI by A&C Catalysts is a 2-methyl imidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high chemical... view more
Bimax
HSP Distance: 2.1
N-Acryloyl sarcosine methyl ester. It reacts with a full range of acrylates & methacrylates and has high refractive index. It is used for the production of resins for solid phase peptide synthesis... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.1
Trimethylolpropane tri (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMP is solvent free and exhibits high reactivity, low viscosity as... view more
HSP Distance: 2.1
Imicure® AMI-2 by Evonik acts as a dicyandiamide accelerator and curing agent. It is an elevated-temperature curing agent for epoxy resins. It is readily compatible with both liquid and solid epoxy... view more
Kowa
HSP Distance: 2.1
Kowa MPM is a methyl-3-mercaptopropionate. It is a sulfur-based monomer. Used in adhesives... view more
HSP Distance: 2.1
Kowa DPMP is a trimethylolpropane-tris-(3-mercaptopropionate). It is a sulfur-based monomer. Used in adhesives... view more
HSP Distance: 2.2
2-Hydroxy-2-methyl-1-phenyl-1-propane-one. Used in adhesives. Offers non-yellowing properties and good shelf stability... view more
HSP Distance: 2.2
Irgacure® 1173 (Old name: Darocur® 1173) by BASF is a photoinitiator composed of 2-Hydroxy-2-methyl-1-phenyl-propan-1-one grade. Used in reactive and radiation curing adhesives. Irgacure® 1173... view more
HSP Distance: 2.2
Ureido Methacrylate 25 % in Methyl Methacrylate (UMA 25 %) by BASF is an ureido funcional methacrylate monomer. It imparts properties such as crosslinking, adhesion and rheological modification to... view more
HSP Distance: 2.2
VISIOMER® MEEU 25 M by Evonik is N-(2-Methacryloyloxyethyl) ethylene urea (25% in methyl methacrylate) grade. It is used to impart wet adhesion and wet scrub resistance to polymers. VISIOMER® MEEU... view more
HSP Distance: 2.2
VISIOMER® MEEU 50 W by Evonik is an N-(2-Methacryloyloxyethyl) ethylene urea (50% in water) grade. It is designed to improve wet adhesion properties of emulsion polymers and wet scrub resistance of... view more
IGM Resins
HSP Distance: 2.2
Esacure KL 200 by IGM Resins is 2-hydroxy-2-methyl-1-phenyl-1-propanone based photoinitiator. It provides high reactivity and low yellowing properties. It is used for photopolymerization of UV... view more
IGM Resins
HSP Distance: 2.2
Omnirad 1173 (Old name: Irgacure 1173) by IGM Resins is a highly efficient, low yellwoing type I photoinitiator. It provides surface-, through-, LED and high speed cure. Omnirad 1173 is used to... view more
IGM Resins
HSP Distance: 2.2
Omnirad 73 by IGM Resins acts as a free-radical type I photoinitiator. It is designed for UV radiation curing system. It provides through-, surface- and LED cure. Omnirad 73 is suitable for clear... view more
HSP Distance: 2.2
Kowa Topolene M is 3-chloro-2-hydroxy-propyl methacrylate. It is mono-functional monomer... view more
Lambson (Sartomer)
HSP Distance: 2.2
SpeedCure 73 by Lambson (Sartomer) is a 2-hydroxy-2-methyl-1-phenylpropanone. Acts as a highly efficient, widely used, Type I photoinitiator. Radicals are formed by an α cleavage mechanism and as... view more
Applications
HSP Distance: 2.2
Greatcure 1173 by Lanxess is a highly efficient photo-initiator in UV-curable systems. Greatcure 1173 is used in adhesives... view more
HSP Distance: 2.2
Photoinitiator used for the photopolymerization of UV Curable systems based on acrylic unsaturated oligomers and monomers. Very good compatibility with acrylate chemistries, exhibits low odor in... view more
Runtec Chemical
HSP Distance: 2.2
1-Hydroxy-2-methylpheny-propane-1-one. Acts as a photoinitiator. It is a colorless or slightly yellow liquid with 164.2 molecular weight... view more
Applications
Suny Chem
HSP Distance: 2.2
Sunitor 1173 by Suny Chem is a 2-hydroxy-2-methyl-1-phenyl propanone grade. Sunitor 1173 is used in adhesives... view more
Applications
HSP Distance: 2.3
Kowa BA-2 is an ethoxylated bisphenol A. Used in adhesives... view more
Kyoeisha Chemical
HSP Distance: 2.4
2-Acryloyloxy ethyl phthalate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Nagase Specialty Materials
HSP Distance: 2.4
NAM- HOAMPL by Nagase Specialty Materials is a 2-acryloyloxy ethyl phthalate. Offers good adhesion. It is registered in TSCA... view more
HSP Distance: 2.6
Lapox® ARTF-35 by Atul is a low viscosity, unmodified trifunctional epoxy resin based on para-aminophenol. Exhibits high chemical resistance, high glass transition temperature, outstanding heat... view more
Applications
HSP Distance: 2.6
Lapox® ARTF-36 by Atul is a high purity, distilled, low viscosity, unmodified trifunctional epoxy resin based on para-aminophenol. Exhibits high chemical resistance, high glass transition... view more
Applications
HSP Distance: 2.6
Aminoethylenepiperazine (AEP-HP) by Huntsman is a high purity curing agent for epoxy resins. It also functions as a corrosion inhibitor and mineral processing aid. It is clear, colorless, cyclic... view more
HSP Distance: 2.6
Araldite® MY 0500 by Huntsman is a low viscosity, high functionality amine based epoxy resin. It is an aero-grade. It cures very rapidly to produce products having exceptionally high heat deflection... view more
Applications
HSP Distance: 2.6
Araldite® MY 0510 is a triglycidylized para-amino-phenol by Huntsman. It is a very low viscosity, high functionality amine-based, high purity resin with relatively good storage stability. It cures... view more
HSP Distance: 2.6
N-aminoethylpiperazine (AEP) by Huntsman Advanced Materials is an N-aminoethylpiperazine. It is an epoxy resin curing agent. N-aminoethylpiperazine (AEP) is used to formulate epoxy systems for... view more
A&C Catalysts
HSP Distance: 2.7
Resicure™ EMI-24 by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more
A&C Catalysts
HSP Distance: 2.7
Resicure™ EMI-24 LV by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more
A&C Catalysts
HSP Distance: 2.7
2-Ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It appears as amber to yellow liquid. It also also delays the cross-linking of polyester reactions. It is used in adhesives... view more
A&C Catalysts
HSP Distance: 2.7
2-Ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It is low viscosity amber to yellow liquid. It also also delays the cross-linking of polyester reactions. It is used in... view more
HSP Distance: 2.7
Kowa M-600A is a 2-hydroxy-3-phenoxypropyl acrylate. It is a mono-functional monomer... view more
Kyoeisha Chemical
HSP Distance: 2.7
2-Hydroxy-3-phenoxy propyl acrylate. Offers excellent reforming functions. Used for manufacturing adhesives... view more
Nagase Specialty Materials
HSP Distance: 2.7
NAM-128H by Nagase Specialty Materials is a 2-Hydroxy 3-phenoxy propyl acrylate. Offers good flexibility, good adhesion, fast cure speed and has low odor. It is registered in TSCA... view more
Nagase Specialty Materials
HSP Distance: 2.7
NAM-702A by Nagase Specialty Materials is a 2-Hydroxy 3-phenoxy propyl acrylate. Offers good flexibility and good adhesion. It is registered in TSCA... view more
Nagase Specialty Materials
HSP Distance: 2.7
NAM-M600A by Nagase Specialty Materials is a 2-Hydroxy 3-phenoxy propyl acrylate. Offers good flexibility and good adhesion. It is registered in TSCA... view more
HSP Distance: 2.7
Methacryloyl-L-lysine. It is a white powder. Used as a building block for producing custom made polymers with pendant amine functionality. It complies with FDA 40 CFR 720.36 regulation... view more
HSP Distance: 2.7
Methacryloyl-L-Lysine. Can be used as a building block for producing custom made polymers with pendant amine functionality... view more
SHOWA DENKO
HSP Distance: 2.7
Pentaerythritol tetrakis. It acts as a curing agent. Improves curing speed, sensitivity and reactivity, which leads to a reduction in the amount of energy necessary for production and processing... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.8
Tris [2-(3-mercaptopropionyloxy) ethyl] isocyanurate. Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TEMPIC is solvent free and exhibits high reactivity, low... view more
HSP Distance: 2.8
Methacroyloxyethyl phthalate (HEMA phthalate). It is an aromatic, carboxylic acid-containing monomer which lends itself to many adhesive applications where functionality of a methacrylate is needed... view more
HSP Distance: 2.8
Kowa TEMPIC is a tris[2-(3-mercaptopropionyloxy)ethyl] isocyanurate. It is a sulfur-based monomer. Used in adhesives... view more
HSP Distance: 2.8
N-methyl-2-pyrrolidone (NMP) by LyondellBasell is a powerful solvent. It offers exceptional performance, broad solubility for resins, high chemical and thermal stability. Due to its high solvency... view more
Nagase ChemteX
HSP Distance: 2.8
Denacol® EX-811 is a bi-functional ethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-811 is recommended for adhesives. It offers viscosity adjustment. It... view more
Applications
Nagase ChemteX
HSP Distance: 2.8
Denacol® EX-821 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-821 is recommended for adhesives. It offers viscosity adjustment... view more
Applications
Nagase ChemteX
HSP Distance: 2.8
Denacol® EX-830 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment and flexibility. Denacol® EX-830 is recommended... view more
Applications
Nagase ChemteX
HSP Distance: 2.8
Denacol® EX-832 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-832 is recommended for adhesives. It offers viscosity adjustment... view more
Applications
Shin-Nakamura Chemicals
HSP Distance: 2.8
β-Methacryloyloxyethyl hydrogen phthalate. It is a monofunctional methacrylate... view more
IGM Resins
HSP Distance: 2.9
Omnirad 2959 (Old name: Irgacure 2959) by IGM Resins is a highly efficient, non-yellowing, type I photoinitiator for the UV curing of systems comprising of unsaturated monomers and prepolymers. It... view more
A&C Catalysts
HSP Distance: 3.0
Technicure® PDU-250M by A&C Catalysts is a N,N-dimethyl-N-phenyl urea, is a substituted urea. Technicure® PDU-250M is a dicyandiamide (DICY) accelerator. Provides good formulation shelf stability... view more
A&C Catalysts
HSP Distance: 3.0
N,n-dimethyl phenyl urea. It acts as curing agent and accelerator for dicyandiamide. It is an aromatic substituted urea based accelerator existing as off white powder. It provides fast curing, high... view more
HSP Distance: 3.0
Disponil® SUS IC 680 by BASF is an anionic dihexyl sulphosuccinate, sodium salt. Provides stabilizing properties. Used as emulsifier in polymer emulsions for adhesives. Disponil® SUS IC 680 is also... view more
Applications
HSP Distance: 3.0
Loxanol® PL 5031 (Old Name: Plastilit 3431) by BASF is a plasticizer for resins and aqueous polymer dispersions. It is used in tackifying additives for dispersion adhesives such as flooring... view more
HSP Distance: 3.0
Protectol™ PE by BASF is a phenoxyethanol. Acts as a biocide. Offers biocidal performance alone or in combination with other actives. Protectol™ PE is used in water-based adhesives... view more
HSP Distance: 3.0
Protectol™ PE S by BASF is a phenoxyethanol. Acts as a biocide. Offers biocidal performance alone or in combination with other actives. Protectol™ PE S is used in water based adhesives... view more
HSP Distance: 3.0
DALPAD A by Dow is a slow-evaporating glycol ether-based coalescing agent. This low odor, hydrophilic additive is used in latex adhesives. DALPAD A exhibits high polymer solvency... view more
Applications
HSP Distance: 3.0
DOWANOL™ EPh Glycol Ether by Dow is a low odor, aromatic ethylene glycol phenyl ether with slow evaporation. It possesses high polymer solvency. DOWANOL™ EPh Glycol Ether is used in latex adhesives... view more
Applications
HSP Distance: 3.0
Amicure® UR by Evonik is a substituted urea-based accelerator (1 Phenyl 3,3 dimethyl urea) for dicyandiamidecured epoxy resins. It acts as a curing agent. It combines excellent latency at ambient... view more
HSP Distance: 3.0
Amicure® UR-S by Evonik is a substituted urea-based cure accelerator. It is used in one-component paste and film adhesives. It offers advantages such as rapid cure and property development, high... view more
HSP Distance: 3.0
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more
HSP Distance: 3.0
Phenoxyethanol by Lanxess is used as a crosslinking agent. It is effective against gram positive and gram negative bacteria and fungi. Phenoxyethanol complies with FDA 21 CFR 175.105 for indirect... view more
Applications
Nagase ChemteX
HSP Distance: 3.0
Denacol® EX-850 is a bi-functional diethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. Denacol® EX-850 is recommended for adhesives. It... view more
Applications
Nagase ChemteX
HSP Distance: 3.0
Denacol® EX-851 is a bi-functional diethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It provides 99% water solubility. It offers viscosity adjustment. Denacol®... view more
Applications
HSP Distance: 3.1
Heat reactive, phenolic resin. Used in the resin curing of butyl rubbers, adhesive systems and sealants. Possesses very good compatibility with chloroprene, nitrile and natural rubbers. Provides... view more
HSP Distance: 3.1
Oil soluble, heat reactive phenolic resin. Used in neoprene solvent type contact cements. Provides high heat resistance, high cohesive strength, shorter open time, and light color. Possesses... view more
HSP Distance: 3.1
Akrochem® P-133 by Akrochem is a thermoplastic, alkyl phenolic resin tackifier. Develops high tack levels in rubber compounds which are used in tire construction and mechanical goods. Provides tack... view more
HSP Distance: 3.1
One-step, powdered phenolic resin. Possesses thermosetting characteristics with a medium-to-high flow, medium-cure and set. Used in adhesives to bond rubber, metal and vinyl plastics. Provides good... view more
Applications
HSP Distance: 3.1
Akrochem® P-28 by Akrochem is a non-staining, heat reactive alkylphenol-formaldehyde resins resin. Used in neoprene solvent cements. Increases the heat resistance of the adhesive when used with an... view more
HSP Distance: 3.1
One-step, powdered phenolic resin. Possesses thermosetting characteristics with a medium-to-high flow, medium-cure and set. Used in adhesives to bond rubber, metal, and vinyl plastics. Provides good... view more
Applications
HSP Distance: 3.1
Finely pulverized thermosetting phenolic resin of the two-step type. Used as a hardening and a reinforcing agent for nitrile, nitrile-SBR blends, and polybutadiene polymers. Possesses medium flow... view more
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