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Adhesives Ingredients
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Adhesives Ingredients
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Products Compatible with PVP K-80/85

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
572 products match your search
Product Name
Supplier
Description
Ashland Specialty Chemical
HSP Distance: 0.0
N-vinyl-2-pyrrolidone. It is a clear liquid stabilized with insoluble sodium hydroxide or soluble N,N’-di-sec-butyl-p-phenylenediamine. It accelerates UV curing rates as the reactive diluent. It... view more
HSP Distance: 0.0
N-Vinyl-pyrrolidone by BASF is the best choice for a wide range of syntheses including polymerization, addition and electro-cyclic reactions. Shows high reactivity for radical polymerization... view more
HSP Distance: 0.0
Houchi Chemical N-Vinyl-2-Pyrrolidone (NVP) is pyrrolidone monomer. Used in adhesives... view more
Huangshan Bonsun Pharmaceuticals
HSP Distance: 0.0
N-vinyl-2-pyrrolidone monomer. It is colorless to slightly yellowish transparent liquid. Reactive and susceptible to hydrolyzation and polymerization. Soluble in water and a variety of organic... view more
IGM Resins
HSP Distance: 0.0
Omnimer NVP by IGM Resins is 1-vinyl-2-pyrrolidone. It offers good flexibility and adhesion. Omnimer NVP is a versatile monofunctional reactive diluent for radical initiated UV radiation cured... view more
Jarchem Industries
HSP Distance: 0.0
N-vinyl-2-pyrrolidone. It is a UV/EB reactive monomer. Used in the manufacture of adhesives... view more
HSP Distance: 0.6
ERISYS™ GA-240 by Huntsman is a tetrafunctional epoxy resin based on meta-Xylenediamine. It is a nitrogen containing highly reactive resin with a very low viscosity. It suggested for use in... view more
HSP Distance: 0.7
N-Vinyl-imidazole (VIM) by BASF is a monomer designed for UV curing adhesives. Exhibits high reactivity, exceptional quality and good consistency. It is the best choice for a wide range of synthesis... view more
Gelest
HSP Distance: 1.0
Bis(n-mehylbenzamide)ethoxymethylsilane. Used as neutral crosslinker for silicone RTVs... view more
HSP Distance: 1.3
N-Benzylmethacrylamide is a chemically stable solid acrylic monomer. It is used to make polymers of high (1.5965) refractive index. It complies with FDA 40 CFR 720.36 regulation... view more
A&C Catalysts
HSP Distance: 1.4
Resicure™ EMI-24 by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more
A&C Catalysts
HSP Distance: 1.4
Resicure™ EMI-24 LV by A&C Catalysts is a 2-ethyl-4-methylimidazole. It is used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Offers high... view more
A&C Catalysts
HSP Distance: 1.4
2-Ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It appears as amber to yellow liquid. It also also delays the cross-linking of polyester reactions. It is used in adhesives... view more
A&C Catalysts
HSP Distance: 1.4
2-Ethyl-4-methylimidazole. It acts as epoxy catalyst and curing agent. It is low viscosity amber to yellow liquid. It also also delays the cross-linking of polyester reactions. It is used in... view more
HSP Distance: 1.6
Polyfunctional glycidyl ether of trimethylolpropane. Acts as a reactive diluent or viscosity reducer with high reactivity for liquid epoxy resins. Has low viscosity and low temperature curing. Its... view more
HSP Distance: 1.6
Araldite® DY-T by Huntsman is a trifunctional reactive diluent for epoxy resins. It has a low molecular weight, slight reduction of viscosity, maintained high reactivity, fair to good improvement of... view more
HSP Distance: 1.6
ERISYS™ GE-30 by Huntsman is a low viscosity trimethylolpropane triglycidyl ether grade. It is a high epoxy functional resin. It provides very good crosslinking, good reactivity. It can be cured... view more
Leuna Harze
HSP Distance: 1.6
Epilox® P 13-30 by Leuna Harze is a reactive diluent. It is easily miscible with epoxy resins and can therefore be used to reduce the viscosity of standard epoxy resins. Epilox® P 13-30 is used as a... view more
Leuna Harze
HSP Distance: 1.6
Epilox® P 13-31 by Leuna Harze is a reactive diluent. It is easily miscible with epoxy resins and can therefore be used to reduce the viscosity of standard epoxy resins. It is used as a modifying... view more
Nagase ChemteX
HSP Distance: 1.6
Denacol® EX-911 is a bi-functional propylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. Denacol® EX-911 is recommended for adhesives. It... view more
Applications
Nagase ChemteX
HSP Distance: 1.6
Denacol® EX-920 is a bi-functional polypropylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. It shows good compatibility and... view more
Applications
Nagase ChemteX
HSP Distance: 1.6
Denacol® EX-941 is a bi-functional polypropylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. Denacol® EX-941 is recommended for adhesives... view more
Applications
HSP Distance: 1.7
Ureido Methacrylate 25 % in Methyl Methacrylate (UMA 25 %) by BASF is an ureido funcional methacrylate monomer. It imparts properties such as crosslinking, adhesion and rheological modification to... view more
HSP Distance: 1.7
VISIOMER® MEEU 25 M by Evonik is N-(2-Methacryloyloxyethyl) ethylene urea (25% in methyl methacrylate) grade. It is used to impart wet adhesion and wet scrub resistance to polymers. VISIOMER® MEEU... view more
HSP Distance: 1.7
VISIOMER® MEEU 50 W by Evonik is an N-(2-Methacryloyloxyethyl) ethylene urea (50% in water) grade. It is designed to improve wet adhesion properties of emulsion polymers and wet scrub resistance of... view more
HSP Distance: 1.7
It is the cyclohexane dimethanol diglycidyl ether. Acts as viscosity reducing modifier. It is fully compatible with the entire bisphenol A based series of epoxy resins as well as higher... view more
HSP Distance: 1.7
Araldite® DY-C is a difunctional, aliphatic, reactive diluent for epoxy resins. Offers moderate to low viscosity and improved processability. It has less tendency to turn yellow. Provides virtually... view more
HSP Distance: 1.7
ERISYS™ GE-22 by Huntsman is a low viscosity, cycloaliphatic diepoxide, epoxidized cyclohexanedimethanol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses... view more
New Japan Chemical
HSP Distance: 1.7
1,4-cyclohexane dimethanol diglycidylether. It has less viscosity and less Tg deterioration. It has excellent in weather resistance, mechanical characteristics and electric characteristics. It... view more
Applications
HSP Distance: 1.8
Lapox® ARD-51 (K-77) by Atul is a low viscosity, aliphatic diepoxide reactive diluent based on 1, 4 butanediol. Offers high resistance to solvents and ammonia. It improves wetting and processability... view more
Applications
HSP Distance: 1.8
Lapox® ARD-60 by Atul is an aliphatic diepoxide reactive diluent based on 1,4 butanediol. It offers high level of purity compared to Lapox® ARD-51. Exhibits low viscosity, good flexibility with no... view more
HSP Distance: 1.8
AMINE™ CS-1246 by Dow is 5-Ethyl-1-aza-3,7-dioxabicyclo [3,3,0] octane. Used as a crosslinking and curing agent for adhesive applications. Imparts great flexibility and elongation characteristics... view more
HSP Distance: 1.8
Broad-spectrum bactericide based on oxazolidine (1-aza- 3,7-dioxa-5-ethylbicyclo (3.3.0) octane). Used in adhesives based on starch, protein, gums and latex. Offers protection from microbial... view more
Applications
HSP Distance: 1.8
HELOXY™ Modifier 67 by Hexion is 1, 4-butanediol diglycidyl ether. Acts primarily as a reactive diluent or viscosity reducer for adhesive applications. It is compatible with bisphenol-based epoxy... view more
Applications
HSP Distance: 1.8
Diglycidyl ether of 1,4-butanediol. Acts as a reactive diluent or viscosity reducer for liquid epoxy resins. Improves the wetting characteristics and facilitates the air release. Reduces the... view more
Hubei Green Home Chemical
HSP Distance: 1.8
1,4-Butanediol diglycidyl ether. Acts as a solvent and curing agent. It has low virulence, slight color and low viscosity. It is well miscible with all kinds of epoxy resins, used in epoxy resin... view more
HSP Distance: 1.8
Araldite® DY 026 by Huntsman is a diglycidylether of butanediol. Acts as a monofunctional reactive diluent for epoxy resins. Araldite® DY 026 is an aero and electronic grade... view more
HSP Distance: 1.8
Araldite® DY-D is a difunctional reactive diluent for epoxy resins by Huntsman. Chemically based on diglycidylether of butanediol. Shows a fair to good reduction of viscosity, elimination of... view more
HSP Distance: 1.8
ERISYS™ GE-21 by Huntsman is low viscosity, aliphatic, diepoxide, epoxidized butanediol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses compatibility at... view more
IGM Resins
HSP Distance: 1.8
Omnirad MBF by IGM Resins is a highly efficient, free-radical, type II photoinitiator. It is used to initiate radical polymerization of unsaturated oligomers such as acrylates after exposure to UV... view more
Lambson (Sartomer)
HSP Distance: 1.8
SpeedCure MBF by Lambson (Sartomer) is a methylbenzoylformate. Acts as a highly efficient photoinitiator. Exhibits low odor and low oxygen inhibition. Offers excellent surface cure response... view more
Applications
HSP Distance: 1.8
Low odor methylbenzoylformate. It acts as photoinitiator. It complies with following regulations: REACH, TSCA, METI, IECSC and ECL... view more
Applications
HSP Distance: 1.9
N-methyl-2-pyrrolidone (NMP) by LyondellBasell is a powerful solvent. It offers exceptional performance, broad solubility for resins, high chemical and thermal stability. Due to its high solvency... view more
Nagase ChemteX
HSP Distance: 1.9
Denacol® EX-811 is a bi-functional ethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-811 is recommended for adhesives. It offers viscosity adjustment. It... view more
Applications
Nagase ChemteX
HSP Distance: 1.9
Denacol® EX-821 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-821 is recommended for adhesives. It offers viscosity adjustment... view more
Applications
Nagase ChemteX
HSP Distance: 1.9
Denacol® EX-830 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment and flexibility. Denacol® EX-830 is recommended... view more
Applications
Nagase ChemteX
HSP Distance: 1.9
Denacol® EX-832 is a bi-functional polyethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. Denacol® EX-832 is recommended for adhesives. It offers viscosity adjustment... view more
Applications
HSP Distance: 2.0
Irganox® MD 1024 is a primary phenolic antioxidant by BASF. Provides unmatched extraction resistance and processing stabilization. Used for wire and cable resins, filled polyolefins and NBR. Also... view more
Bioray Chem
HSP Distance: 2.0
2’,3-bis[[3-[3,5-di-tert-butyl-4-hydroxyphenyl]propionyl]] propionohydrazide. Acts as a metal deactivator and antioxidant. Can be used as the primary antioxidant or can be used in combination with... view more
HSP Distance: 2.0
Stabilizer and metal desactivator. Used in adhesives and sealants. Possesses antioxidant properties... view more
HSP Distance: 2.0
Stabilizer and metal desactivator. Used in adhesives and sealants. Possesses antioxidant properties... view more
HSP Distance: 2.0
Lonzamon™ AATMP by Lonza is a low viscous, toxicologically friendly, propane-1,1,1-triyltrimethyl tris (acetoacetate) grade. Used as an adhesion promoter to metallic, mineral and wood surfaces... view more
HSP Distance: 2.0
Hindered phenolic antioxidant/metal deactivator used in reducing or preventing the harmful effect of copper or other metals upon various polymers. Can be used in hot melt and solution... view more
Nagase ChemteX
HSP Distance: 2.0
Denacol® EX-850 is a bi-functional diethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It offers viscosity adjustment. Denacol® EX-850 is recommended for adhesives. It... view more
Applications
Nagase ChemteX
HSP Distance: 2.0
Denacol® EX-851 is a bi-functional diethylene glycol diglycidyl ether by Nagase ChemteX. It acts as a diluting agent. It provides 99% water solubility. It offers viscosity adjustment. Denacol®... view more
Applications
Qingdao Jade New Material Technology
HSP Distance: 2.0
JADEWIN AN 1024 by Qingdao Jade New Material Technology is a 1,2-Bis (3,5-di-tert-butyl-4-hydroxyhydrocinnamoly) hydrazine. Acts as a metal deactivator and antioxidant. Exhibits extraction... view more
Qingdao Jade New Material Technology
HSP Distance: 2.0
JADEWIN 697 by Qingdao Jade New Material Technology is a (1,2-Dioxoethylene)bis(iminoethylene)bis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate). Acts as a hindered phenolic antioxidant and metal... view more
HSP Distance: 2.0
RIANOX MD-1024 (Old name: THANOX MD-1024) is a phenolic antioxidant by Rianlon. It offers high performance, improved long-term thermal stability, processing stability and maintenance of color... view more
HSP Distance: 2.0
RIANOX MD-697 (Old name: THANOX MD-697) is a phenolic antioxidant by Rianlon. It is compatible with polyethylene, polyamide, polypropylene, polystyrene, polyester, polyurethane, rubber and PVC. It... view more
SHOWA DENKO
HSP Distance: 2.1
AOI-VM™ by Showa Denko, is a high-performance, multipurpose 2-acryloyloxyethylisocyanate (AOI) versatile monomer (VM). It contains not only an isocyanate group, which easily binds to various... view more
SHOWA DENKO
HSP Distance: 2.1
2-Isocyanatoethyl acrylate. It is a clear, colorless or slightly yellowish liquid. It has high reactivity and is very effective in UV curing. Shows a higher curing rate in comparison to standard... view more
HSP Distance: 2.2
Alicyclic epoxy resin. Used in insulating sealants for semiconductors and transparent insulating sealants for optoelectronics such as light-emitting diode. Offers low viscosity, no halogen... view more
Applications
HSP Distance: 2.2
Good reactivity, alicyclic epoxy resin. Used in insulating sealants for semiconductors and transparent insulating sealants for optoelectronics such as light-emitting diode. Offers low viscosity, no... view more
Applications
HSP Distance: 2.2
Highly reactive, alicyclic epoxy resin. Used in insulating sealants for semiconductors and transparent insulating sealants for optoelectronics such as light-emitting diode. Offers low viscosity, no... view more
Applications
Gabriel Chemical
HSP Distance: 2.2
3, 4– epoxycyclohexylmethyl-3' 4'– epoxycyclohexanecarboxylate. Acts as rheology modifier. It is a cycloaliphatic, diepoxy functional compound and the combination of aliphatic backbone, high oxirane... view more
Gabriel Chemical
HSP Distance: 2.2
It is a 3, 4 – epoxycyclohexylmethyl-3', 4' – epoxycyclohexanecarboxylate. Acts as cycloaliphatic epoxy resin. It reacts in the presence of acid anhydride curing agents at higher. With about 200°C... view more
HSP Distance: 2.2
ERISYS™ GE-12 Glycidyl by Huntsman is ether of nonyl phenol. Used as a reactive diluent in adhesives and sealants. It offers compatibility with all epoxy resins. It can be cured with most... view more
Huntsman
HSP Distance: 2.2
ERISYS™ RDGE by Huntsman is resorcinol diglycidyl ether, low viscosity aromatic difunctional epoxy resin. It can be used as the sole resin in an epoxy formulation or as a reactive modifier in... view more
HSP Distance: 2.2
ERISYS™ RDGE-H by Huntsman is a high purity resorcinol diglycidyl ether, low viscosity aromatic difunctional epoxy resin. It is used in conductive adhesives. It possesses compatibility with all... view more
Applications
Lambson (Sartomer)
HSP Distance: 2.2
UviCure S105 by Lambson (Sartomer) is a low viscosity 7-oxabicyclo[4.1.0]hept-3-ylmethyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate (standard cycloaliphatic epoxy base resin). Acts as a cationic... view more
Lambson (Sartomer)
HSP Distance: 2.2
UviCure S105E by Lambson (Sartomer) is a low viscosity 7-oxabicyclo[4.1.0]hept-3-ylmethyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate (standard cycloaliphatic epoxy base resin). Acts as a cationic... view more
Lambson (Sartomer)
HSP Distance: 2.2
UviCure S110LV by Lambson (Sartomer) is a low viscosity 7-oxabicyclo[4.1.0]hept-3-ylmethyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate (standard cycloaliphatic epoxy base resin). Acts as a cationic... view more
HSP Distance: 2.3
Methacroyloxyethyl phthalate (HEMA phthalate). It is an aromatic, carboxylic acid-containing monomer which lends itself to many adhesive applications where functionality of a methacrylate is needed... view more
HSP Distance: 2.3
VISIOMER® DMAPMA by Evonik is dimethylaminopropyl methacrylamide. It is manufactured in industrial settings in closed systems and used by industry for manufacture of polymers in closed and... view more
HSP Distance: 2.3
Kowa DMAPMA is dimethyl amino propyl methacrylamide. Used in adhesives... view more
HSP Distance: 2.4
Amine synergist. Used in adhesives... view more
HSP Distance: 2.4
Lapox® ARD-52 (XR-86) by Atul is a low viscosity, aliphatic diepoxide reactive diluent based on 1,6 hexanediol. Offers good flexibility, improved wetting and processability and reduced viscosity... view more
Applications
HSP Distance: 2.4
HELOXY™ Modifier HD by Hexion is diglycidyl ether of 1,6-hexanediol. It functions as a reactive diluent or viscosity reducer for liquid epoxy resins. It reduces the viscosity while maintaining most... view more
HSP Distance: 2.4
Araldite® DY-H by Huntsman is based on Diglycidylether of 1.6-hexanediol with low molecular weight and high vapor pressure. It is a difunctional, aliphatic, reactive diluent that may be mixed with... view more
Applications
IGM Resins
HSP Distance: 2.4
Omnirad EDB by IGM Resins is a highly efficient tertiary amine synergist which is used in conjunction with type II photoinitiator. It generates free radicals that initiate radical polymerization of... view more
Lambson (Sartomer)
HSP Distance: 2.4
SpeedCure EDB by Lambson (Sartomer) is an ethyl-4-(dimethylamino)benzoate. Acts as an efficient amine synergist. When used in conjunction with Type II photoinitiators, it generates free radicals (by... view more
Penn A Kem
HSP Distance: 2.4
Furan. Acts as a versatile starting material of many chemicals. It is more consistent and of higher quality. Furan is a highly flammable chemical and contact should be avoided because of its toxic... view more
HSP Distance: 2.4
2-Bromoethyl acrylate. It is a chemically stable colorless liquid. It is a reactive halogen and is used in curable and reactive polymers and in synthesis of other monomers. It complies with FDA 40... view more
HSP Distance: 2.4
Ethyl-4-dimethylaminobenzoate. It acts as curing agent. It is insoluble in water. Suitable for offset-, flexo- and screen-inks. It complies with following regulations: REACH, TSCA, METI, ECL, IECSC... view more
Applications
Aekyung Chemical
HSP Distance: 2.5
AKNATE TM-50Y by Aekyung Chemical is a TDI, toluene diisocyanates. It provides hardness, workability, solubility and stability. It has a good merit of long pot life. AKNATE TM-50Y is compatible with... view more
Aekyung Chemical
HSP Distance: 2.5
AKNATE TM-75Y by Aekyung Chemical is a TDI, toluene diisocyanates. It provides hardness, workability, solubility and stability. It has a good merit of long pot life. AKNATE TM-75Y is compatible with... view more
Aekyung Chemical
HSP Distance: 2.5
AKNATE TR-50 by Aekyung Chemical is a TDI, toluene diisocyanates. It provides hardness and fast drying properties. AKNATE TR-50 is compatible with alkyd polyol, acrylic polyol, polyester polyol... view more
Aekyung Chemical
HSP Distance: 2.5
AKNATE TR-50EA by Aekyung Chemical is a TDI, toluene diisocyanates. It provides hardness and fast drying properties. AKNATE TR-50EA is compatible with alkyd polyol, acrylic polyol, polyester polyol... view more
Aekyung Chemical
HSP Distance: 2.5
AKNATE TR-60BA by Aekyung Chemical is a TDI, toluene diisocyanates. It provides hardness and fast drying properties. AKNATE TR-60BA is compatible with alkyd polyol, acrylic polyol, polyester polyol... view more
HSP Distance: 2.5
Lupragen® N 106 by BASF acts as catalyst. It is soluble in water and hygroscopic in nature. Lupragen® N 106 is used for polyurethane adhesives and sealants... view more
HSP Distance: 2.5
Ethylene dichloride (99.9%). It is an oily liquid, clear and colorless substance that presents a sweet chloroform-like odor. Used in manufacture of VCM (vinyl chloride monomer) which is further... view more
Bruno Bock chemische Fabrik
HSP Distance: 2.5
Trimethylolpropane tri (3-mercaptopropionate). Acts as a cross linking agent. It is based on mercaptocarboxylic acids. THIOCURE® TMPMP is solvent free and exhibits high reactivity, low viscosity as... view more
HSP Distance: 2.5
FILMGUARD™ IPBC 100 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications... view more
HSP Distance: 2.5
FILMGUARD™ IPBC 20 by Dow is a broad spectrum, fungicidal agent. It is used in flooring adhesives & carpet backings and sealants. FILMGUARD™ IPBC 20 provides protection from fungal attack in... view more
HSP Distance: 2.5
FILMGUARD™ IPBC 40 by Dow is a broad spectrum, fungicidal agent. It provides protection from fungal attack in wet-state of products, while protecting their dry-state end-use applications. FILMGUARD™... view more
Evermore Chemical Industry
HSP Distance: 2.5
SC-45 by Evermore Chemical Industry is a toluene diisocyanate (TDI) grade. It is a crosslinker. Used in adhesives. SC-45 can be diluted with ethyl acetate and toluene solvents... view more
Applications
Evermore Chemical Industry
HSP Distance: 2.5
SC-45LT by Evermore Chemical Industry is a free toluene diisocyanate (TDI) grade. Used in adhesives. It is a crosslinker. SC-45LT can be diluted with ethyl acetate solvent... view more
Applications
Evermore Chemical Industry
HSP Distance: 2.5
SC-55 by Evermore Chemical Industry is a toluene diisocyanate (TDI) grade. Designed for adhesive applications. SC-55 can be diluted with ethyl acetate and toluene solvents. It is a crosslinker... view more
Applications
Evermore Chemical Industry
HSP Distance: 2.5
SC-5521 by Evermore Chemical Industry is a free toluene diisocyanate (TDI) grade. It is a crosslinking agent. SC-5521 can be diluted with butyl acetate solvent. Used in adhesives... view more
Applications
Evermore Chemical Industry
HSP Distance: 2.5
SC-60 by Evermore Chemical Industry is a toluene diisocyanate (TDI) grade. It is a crosslinker. SC-60 can be diluted with ethyl acetate and toluene solvents. Used in adhesives... view more
Applications
Elementis
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