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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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Products Compatible with Technicure® MDU-11

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.
33 products match your search
Product Name
Supplier
Description
Mitsui Chemicals
HSP Distance: 1.7
4,4'-Diaminobenzanilide by Provides good adhesion to metals. It is an aromatic diamine. 4,4'-Diaminobenzanilide is used in the polyamide and polyimide applications... view more
Double Bond Chemical
HSP Distance: 2.4
1,1,1’,1’-Tetramethyl-4,4'-(methylene-di-p-phenylene) di-semicarbazide. Acts as an UV absorber. Used in adhesives... view more
HSP Distance: 2.4
CUREZOL® 2E4MZ by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. CUREZOL® 2E4MZ is recommended for structural adhesives... view more
HSP Distance: 2.4
CUREZOL® 2MZ Azine by Evonik acts as an anhydride curing agent and accelerator for dicyandiamide. It is compatible with epoxy resins. It is recommended for structural adhesives. The shelf life of... view more
HSP Distance: 2.4
CUREZOL® 2P4MZ by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It is recommended for adhesives. The shelf life of CUREZOL® 2P4MZ is 3 years. Recommended... view more
HSP Distance: 2.4
CUREZOL® C17Z by Evonik acts as an anhydride and phenolic curing agent and accelerator for dicyandiamide. It offers good latency and rapid reactivity at elevated temperatures. CUREZOL® C17Z is... view more
HSP Distance: 2.7
Tinopal® NFW LIQ by BASF is a biphenyl-stilbene. It is a liquid optical brightener. Tinopal® NFW LIQ is used in adhesives and sealants... view more
Ningbo Actmix Polymer
HSP Distance: 2.8
Actmix® OTOS-80GE F200 is a morpholin-4-yl morpholine-4-carbodithioate. Acts as a vulcanization accelerator. It contains 20 wt% polymer binder and dispersing agent. It is an activator which has... view more
HSP Distance: 3.0
Lapox® ASH-10 by Atul is a white to off-white, odorless, non-volatile crystalline powder. It acts as curing agent with epoxy resins specially to obtain slow reactivity and extended pot life of mix... view more
Applications
HSP Distance: 3.0
Lapox® ASH-10 FF by Atul is a curing agent with epoxy resins specially to obtain slow reactivity and extended pot life of mix. It is white to off-white, odorless, non-volatile crystalline powder... view more
Applications
HSP Distance: 3.0
Lapox® ASH-10 MIC by Atul is a non-volatile micronised powder suitable to disperse uniformly in epoxy resins. It acts as curing agent. Offers slow reactivity and extended pot life of mix. Exhibits... view more
Applications
Everkem
HSP Distance: 3.0
AP 400-DIOL by Everkem is a tetrabromophthalic diol grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the registration... view more
Applications
Gabriel Chemical
HSP Distance: 3.0
It is a 4, 4-diamino diphenyl sulfone. Acts as curing agent. It provides excellent thermal stability, outstanding chemical resistance, and excellent high temperature properties. Gabepro Gps-441 is... view more
HSP Distance: 3.0
Aradur® 9664-1 by Huntsman is a 4,4' diaminodiphenylsulfone grade. It is a curing agent used with Araldite® epoxy resins. Exhibits excellent thermal stability, outstanding chemical resistance and... view more
Huntsman
HSP Distance: 3.0
Aradur® 976-1 by Huntsman is a 4,4' diaminodiphenylsulfone based high performance hardener used with Araldite® epoxy resins. It is an aero grade. Possesses excellent thermal stability, outstanding... view more
HSP Distance: 3.0
4, 4'-Diaminodiphenylsulfone by Mitsui Chemicals is an aromatic sulfone diamine. SO2 offers better performance in bonding carbon-fibers. It also acts as a curing agent. The epoxy resin made from it... view more
HSP Distance: 3.0
4,4'-Diaminodiphenylsulfone by Mitsui Chemicals is used in epoxy resin as a curing agent. It provides excellent flexibility and heat resistance. SO2 offers better performance in bonding... view more
HSP Distance: 3.0
PTA (PURIFIED TEREPHTHALIC ACID) by SABIC is benzene-1,4-dicarboxylic acid. It is a white crystalline powder with slight acidic odor. It is used in the production of polyester products, including... view more
HSP Distance: 3.1
Dazomet Technical by BASF is a biocide, 3,5-dimethyl-2H-1,3,5-thiadiazinane-2-thione. Dazomet Technical is used in adhesives... view more
Applications
HSP Distance: 3.1
Myacide™ DZ by BASF is 3,5-dimethyl-2H 1,3,5-thiadiazinane-2-thione. Acts as a biocide. Offers biocidal performance alone or in combination with other actives. It is readily biodegradable. This... view more
HSP Distance: 3.1
Protectol™ DZ by BASF is 3,5-dimethyl-2H 1,3,5-thiadiazinane-2-thione which is used as a biocide. Offers biocidal performance alone or in combination with other actives. It is readily biodegradable... view more
HSP Distance: 3.2
Lapox® ASH-11 by Atul is a white to brownish, odorless, non-volatile crystalline powder. It is used as curing agent with epoxy resins specially to obtain faster reactivity than 4,4’-DDS. Exhibits... view more
Applications
HSP Distance: 3.2
Lapox® ASH-11 MIC by Atul is an aromatic amine curing agent with fast reactivity than 4,4’-DDS. It is off-white to yellowish-brown, odorless, non-volatile micronised powder suitable to disperse... view more
Applications
Everkem
HSP Distance: 3.2
AP 729 by Everkem is a tris(2,3-dibromoisopropyil) isocianurate grade. Acts as a flame retardant. Used in adhesives. Complies with Regulation 1907/2006 of the European Community concerning the... view more
Applications
Gabriel Chemical
HSP Distance: 3.2
It is a 3, 3- diamino dephenyl sulfone. Acts as curing agents. It provides excellent thermal stability, outstanding chemical resistance, and excellent high temperature properties. Gabepro Gps-331 is... view more
HSP Distance: 3.2
3, 3’-Diaminodiphenylsulfone by Mitsui Chemicals is an aromatic sulfone diamine. It acts as a curing agent for epoxy resin. Offers excellent heat resistance and flexibility. SO2 shows better... view more
HSP Distance: 3.2
3,3'-Diaminodiphenylsulfone by Mitsui Chemicals is a curing agent. SO2 offers better performance in bonding carbon-fibers. Used for a heat-resistant epoxy resin. It offers flexibility... view more
Ningbo Actmix Polymer
HSP Distance: 3.2
Actmix® MTT-80GE F500 is a 3-methylthiazolidine-2-thione. Acts as an accelerator. It is a thiazole heterocycles chemical, contained active sulfur atoms, can be crosslinked with a polymer containing... view more
HSP Distance: 3.6
ZOLDINE® ZT-55 by Dow is a low viscosity 5-Hydroxymethyl-1-aza-3,7-dioxabicyclo [3,3,0] octane used as crosslinking and curing agent. Imparts great flexibility and elongation characteristics, and... view more
HSP Distance: 3.6
ZOLDINE® ZT-65 by Dow is a low viscosity, formaldehyde-free oxazolidine, 5-Hydroxymethyl-1-aza-3,7-dioxabicyclo [3,3,0] octane. Used as a curing agent for phenolic/resorcinol adhesive resins and for... view more
Monument Chemical
HSP Distance: 3.7
Hydroquinone di (beta-hydroxyethyl) ether. It is a symmetrical aromatic diol. Imparts good tensile, elongation, hardness, modulus, and resilience properties to polyurethane elastomers. Used... view more
IGM Resins
HSP Distance: 3.9
Omnirad 2959 (Old name: Irgacure 2959) by IGM Resins is a highly efficient, non-yellowing, type I photoinitiator for the UV curing of systems comprising of unsaturated monomers and prepolymers. It... view more
HSP Distance: 3.9
5,4'-Diamino-2-phenylbenzimidazole by Mitsui Chemicals shows heat resistance. Used in the polyamide fiber applications. 5,4'-Diamino-2-phenylbenzimidazole is listed with TSCA inventory... view more
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