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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients

DIC Corporation

65
Product Name
Supplier
Description
DIC Corporation
UNIDIC V-8000 by DIC Corporation is a solvent-soluble amide-imide resin which contain rigid imide structures and terminal carboxyl groups. Acts as a hardening agent for epoxy resins. Provides high... view more
Applications
  • Adhesives>Solvent based
  • Polymers>Epoxies (EP)
DIC Corporation
PHENOLITE VH-4170 by DIC Corporation is a bisphenol A novolac resin. Exhibits softening point at 103-108°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance... view more
Applications
  • Adhesives
  • Electrical & Electronic Bonding>Poting & Encapsulating
DIC Corporation
EPICLON® 1650-75MPX by DIC Corporation is a flexible epoxy resin. It can be diluted in xylene/ methoxypropanol solution. Exhibits improved impact resistance. EPICLON® 1650-75MPX is used in adhesive... view more
Applications
  • Adhesives
DIC Corporation
UNIDIC V-8005 by DIC Corporation is a solvent-soluble amide-imide resin, containing terminal carboxyl groups and rigid imide structures . Acts as a hardening agent. Provides high mechanical... view more
Applications
  • Adhesives>Solvent based
  • Polymers>Epoxies (EP)
DIC Corporation
PHENOLITE VH-4150 by DIC Corporation is a bisphenol A novolac resin designed for encapsulants. Exhibits softening point at 85-89°C and high cross-linking density. Shows high heat-, moisture- and... view more
Applications
  • Adhesives
  • Electrical & Electronic Bonding>Poting & Encapsulating
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