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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients

HyComp

1
Product Name
Supplier
Description
HyComp® 500
HyComp
Benzoxazine resin. Used in adhesives and sealants. Provides easy processing and long-term operation up to 450°F. Co-cures with epoxies, phenolics, and polyamine. Offers fast cure, no shrinkage and... view more
Applications
  • Adhesives
  • Sealants

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HyComp Brands for Adhesives & Sealants

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HyComp Technologies for Adhesives & Sealants

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