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The Universal Selection Source:
Adhesives Ingredients
10
Product Name
Supplier
Description
Polygon Chemie
Encapsulated latent hardeners for high and low temperature curing, with good storage stability. Have good mechanical properties, high Tg and high peel-strength. Recommended for adhesives... view more
Applications
  • Adhesives
  • Electrical & Electronic Bonding
Polygon Chemie
Polyketone. It has very good compatibility and solubility, good adhesion, very good pigment wetting, high gloss and transparency and low viscosity of solution... view more
Applications
  • Adhesives
Polygon Chemie
High molecular weight acrylate in 65% dihydroterpineol. Shows no residuals after burning. Provides good adhesion to aluminium, plastics and glass... view more
Applications
  • Adhesives
Polygon Chemie
High molecular weight acrylate in 60% methyl ethyl ketone. It is curable with NCO. Provides good adhesion to PET, PMMA, PC and glass... view more
Applications
  • Adhesives
Polygon Chemie
OH-functional, high molecular weight acrylate in 72% ethyl acetate. It is curable with NCO. Provides good adhesion to aluminium, plastics and glass... view more
Applications
  • Adhesives
Polygon Chemie
Special epoxy resins. These are flame-retardants, crystalline types, have low water absorption, high purity, very low chlorine content, high Tg, low Dk/Df values, low viscosity and low/high... view more
Applications
  • Adhesives
  • Electrical & Electronic Bonding
Polygon Chemie
2-functional aliphatic urethane acrylate... view more
Applications
  • Adhesives
Polygon Chemie
Thermoplastic acrylate co-polymer in 40% methyl ethyl ketone... view more
Applications
  • Adhesives
Polygon Chemie
High molecular weight, poly (isobutyl methacrylate) in 40% methyl ethyl ketone... view more
Applications
  • Adhesives
Polygon Chemie
Encapsulated latent hardeners for high and low temperature curing, with good storage stability. Have good mechanical properties, high Tg and high peel-strength. Recommended for adhesives... view more
Applications
  • Adhesives
  • Electrical & Electronic Bonding
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