OK
The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Spolchemie

13
Product Name
Supplier
Description
Spolchemie
TELALIT 0600 is a cycloaliphatic modified amine by Spolchemie. It is used for curing epoxy resins at room temperature. It gives low exothermic effect during processing. TELALIT 0600 imparts... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
Spolchemie
TELALIT 410 by Spolchemie is a low molecular weight aliphatic polyamine. It is suitable for adhesives and civil engineering applications. TELALIT 410 is used for curing epoxy resins at ambient... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
Spolchemie
TELALIT 95 by Spolchemie is a mixture of polyamine adduct, low molecular weight epoxy resins and cycloaliphatic polyamines. TELALIT 95 also consists of additives and accelerators. It is suitable for... view more
Applications
  • Sealants
  • Polymers>Epoxies (EP)
CHS-EPOXY G 530 by Spolchemie is an eco-friendly, low molecular weight, bisphenol-A based epoxy resin. It can be cured at ambient or elevated temperatures. CHS-EPOXY G 530 has high renewable and low... view more
Applications
  • Adhesives
CHS-HARDENER P 11 by Spolchemie is a mixture of polyalkylenepolyamines, containing mostly diethylenetriamine. It is an amine hardener intended for curing epoxy resins. CHS-HARDENER P 11 is suitable... view more
Applications
  • Adhesives
  • Polymers>Epoxies (EP)
2

Spolchemie Technologies for Adhesives & Sealants

Want to list or
update your products?
Want to report errors or
suggest improvements?
Back to Top