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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Toyal

21
Product Name
Supplier
Description
TFM-S02P by Toyal is a spherical, conductive filler. It contains silica as the core material. It offers uniform plating onto each individual particle. It provides superior conductivity, oxidation... view more
Applications
  • Adhesives
TFM-C15F by Toyal is a flake-shaped, conductive filler. It contains copper as the core material. It offers uniform plating onto each individual particle. It provides superior conductivity... view more
Applications
  • Adhesives
TFM-C05P by Toyal is a spherical, conductive filler. It contains copper as the core material. It offers uniform plating onto each individual particle. It provides superior conductivity, oxidation... view more
Applications
  • Adhesives
TFM-S05P by Toyal is a spherical, conductive filler. It contains silica as the core material. It offers uniform plating onto each individual particle. It provides superior conductivity, oxidation... view more
Applications
  • Adhesives
TFZ-A15P by Toyal is aluminum nitride-based filler. It offers high thermal conductivity, moisture resistance and good dielectric properties. It is suitable for sintering applications. It is treated... view more
Applications
  • Adhesives
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Toyal Technologies for Adhesives & Sealants

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