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Anisotropically Conductive Adhesives

SpecialChem / Andy Extance – May 7, 2008

As we approach the end of the first decade of the 21st century, the flat screen TV is arguably the most obvious advance that has been made beyond 20th century technology. It's appropriate then that in this characteristically modern product, we find one of the greatest contemporary challenges for adhesive technology. Liquid-crystal and plasma display TVs, as well as other thin film electronic technologies, demand that electronics are bonded in very close proximity to glass, using the adhesive as a sophisticated addition to the circuit design. Specifically, the challenge is to allow the adhesive to conduct an electrical signal from elevated 'bumps' on an integrated circuit (IC) to the electrodes of the liquid crystal display on the other side of the bond. For this to happen, the adhesive film must be conductive along the bond between the driver IC bumps and the electrodes. Each IC bump must transmit different signals, rather than simply passing an equal charge across the entire adhesive layer. Therefore, the adhesive must be insulating in between each of the driver-display contacts.

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