OK
The Universal Selection Source:
Adhesives Ingredients
Article

Curing Epoxy Adhesives with Dicyandiamide Catalyst

SpecialChem / Edward M. Petrie – Oct 20, 2010

This article first offers an introduction to the two main types of epoxy curing mechanisms. It then describes the characteristics and properties of dicyandiamide and how this material achieves crosslinking with epoxy resins. The article then goes further to describe how dicyandiamide is incorporated into epoxy adhesive formulations. Several starting formulations and resulting application and performance properties are also provided. Epoxy technology gives the formulator an almost unlimited number of tools to employ. The type of epoxy polymer backbone, curative, resinous modifiers, and special additives or fillers all serve as degrees of freedom available in developing an adhesive system for a given application. One of the most important parameters and starting-points for formulation development is the selection of the type of epoxy cure mechanism and the specific curing agent that will be used.

Be the first to comment on "Curing Epoxy Adhesives with Dicyandiamide Catalyst"

Leave a comment





Your email address and name will not be published submitting a comment or rating implies your acceptance to SpecialChem Terms & Conditions
FEICA 2018 European Adhesive and Sealant Conference and EXPO
Back to Top