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Formulation to tailor thermal conductivity

SpecialChem / Dec 19, 2007

In the electronics industry thermally-conductive adhesives serve the dual purposes of bonding materials together and transferring heat away from electronics components to printed wiring boards and heat sinks. By keeping the operating temperature of electronic devices down, thermally-conductive adhesives increase their lifespan.1,2 The single most important component when formulating a thermally conductive adhesive is the filler. Well known thermally conductive fillers range from cheap and commonplace chemicals such as iron oxide and alumina, to more exotic materials such as aluminum nitride, boron nitride, silicon carbide or diamond. Unless thermal conductivity is a particularly critical issue that demands expenditure on extravagant raw materials, it's most likely that relatively economical alumina will be used. Alumina itself has a thermal conductivity of about 35 W/mK, and offers the additional benefit that when used in an ultra-fine particulate form it can impart flame resistance to the overall formulation.

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