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Innovative Dismantling Adhesives Research

SpecialChem / JEC Composites Magazine – Jun 6, 2012

Rescoll Technological Center's patented INDAR process is designed to debond structural adhesive joints on command, making disassembly of adhesive-bonded parts technically and economically feasible and changing the industrial outlook on structural adhesives. The results presented in this paper concern epoxy matrices, although a number of other substrate/adhesive combinations were also tested. Innovative Dismantling Adhesives Research technology, or INDAR, is quite versatile. It can be used with many different combinations of a broad range of structural adhesives (including epoxies, especially aerospace grades, UV-cure adhesives, polyurethane or silicone glues, and more), substrates (such as steel, glass, or aluminium), and surface treatments (including chromicsulphuric bath, sand blasting, wire-brushing, and solvent cleaning), at different activation temperatures.

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