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Selecting Curing Agents for Structural Epoxy Adhesives (Part 2): Elevated Temperature Cure

SpecialChem / Edward M. Petrie – Sep 5, 2012

This is the second part of two articles that describe common epoxy adhesive curing agents and their selection process. This current article focuses on epoxy adhesive systems that require elevated temperature curing conditions. The first part provided information regarding curing agents that are used to achieve cure at room temperature or below. The choice of a particular curing agent or catalyst depends on the processing requirements (e.g., viscosity, pot life, application method, curing temperature, rate of reactivity, mix ratio) and the end-use requirements (e.g., thermal and chemical resistance, shear strength, toughness) of the cured adhesive. The curing agents along with the epoxy resin will determine the type of chemical bonds and the degree of crosslinking that will occur. The first article in this series provides rationale for selecting either a room temperature or an elevated temperature curing epoxy adhesive.

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