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Snap Cure Adhesives Speed the Production of Many Devices

SpecialChem / Edward Petrie – Dec 2, 2009

This article will review some of the recent advances in snap cure adhesive systems. Differences in these formulations over more conventional structural adhesives will be identified. Entry markets for snap cure adhesives and their performance requirements will also be discussed. In the production of high volume consumer and commercial products, fast curing adhesives have been developed that are compatible with automated in-line equipment. In addition to fast cure, these adhesive must have physical properties (e.g., temperature resistance and shear strength) at least as good as those adhesives that require longer curing times. These new products are generally referred to as "snap-cure" adhesives. Snap cure adhesives can reduce processing time and steps, which translates into cycle time reduction and cost savings. To date, their most prominent applications have been in the electronics (die attach adhesives, RFID components, etc.) and medical (catheters, syringes, etc.) sectors.

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