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Description
CS -697
Designer Molecules
CS -697 by Designer Molecules is polyglycidyl ether cyclosiloxane monomer. Exhibits low viscosity, low color, low chloride content and good thermal stability. It is multifunctional, UV curable...
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Dynasylan® SILBOND® 40
Evonik
Dynasylan® SILBOND® 40 by Evonik is an ethyl polysilicate liquid with low viscosity. It is a concentrated form of available silica. It is a partially hydrolyzed mixture of monomers, dimers, trimers...
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Dynasylan® SILBOND® 40-HF
Evonik
Dynasylan® SILBOND® 40-HF by Evonik is ethyl polysilicate. It is a concentrated form of available silica with a flash point above 100°F (38°C), classifying it as a combustible liquid. It is a...
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Dynasylan® SILBOND® 50
Evonik
Dynasylan® SILBOND® 50 by Evonik is ethyl polysilicate. It is one of the most concentrated forms of available silica. It is a partially hydrolyzed mixture of monomers, dimers, trimers, and higher...
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Dynasylan® SILBOND® EG
Evonik
Dynasylan® SILBOND® EG by Evonik is tetraethyl orthosilicate. It has 99.8% of the active content and contains low water content. It is an excellent source of high purity silica. It gets hydrolyzed...
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DMS -H03
Gelest (Mitsubishi Chemical)
DMS -H03 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H11
Gelest (Mitsubishi Chemical)
DMS -H11 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H21
Gelest (Mitsubishi Chemical)
DMS -H21 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H25
Gelest (Mitsubishi Chemical)
DMS -H25 by Gelest (Mitsubishi Chemical) is hydride terminated polydimethylsiloxane. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H31
Gelest (Mitsubishi Chemical)
DMS -H31 by Gelest (Mitsubishi Chemical) is Poly (dimethylsiloxane) hydride terminated. This polymer undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
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