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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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43 products match your search
Product Name
Supplier
Description
D.E.H.™ 125 by Olin is a standard polyamide resin. Provides excellent adhesion to various substrates. D.E.H.™ 125 is recommended for use in adhesives... view more
Applications
D.E.H.™ 140 by Olin is a standard polyamide resin. Exhibits low viscosity and high chemical resistance. Provides excellent adhesion to various substrates and good balance in performances... view more
Applications
Lows cost diethylenetriamine curing agent. Provides a short pot life and cures in minutes with liquid epoxy resins. Used in adhesives... view more
Liquid aliphatic polyamine. Used in adhesives. Acts as an epoxy curing agent. Offers a short pot-life and cures in minutes with standard unmodified liquid epoxy resins... view more
Lows cost tetraethylenepentamine curing agent. Provides short pot life and cures in minutes with liquid epoxy resins. Used in adhesives... view more
Lows cost aliphatic polyamine curing agent. Similar in characteristics to DETA and TETA. Offers good flexibility. Used in two-pack adhesives. Yields much higher peel strength than DETA or TETA at... view more
D.E.H.™ 321 by Olin is a very low viscosity modified bisphenol A epoxy resin allowing large amounts of fillers. Exhibits cure rate similar to undiluted resins and improved acid resistance... view more
Applications
Lows cost aminoethylpiperazine curing agent. Provides short pot life and cures in minutes with liquid epoxy resins. Used in adhesives... view more
Amine adduct curing agent, DETA modified with liquid epoxy. Reacts with liquid epoxy resins at room temperature. Used in two-pack adhesives. Is hygroscopic and may pick up moisture and carbon... view more
Amine blend curing agent, DETA modified with bisphenol A. Reacts with liquid epoxy resins at room temperature. Used in 2-pack adhesives. Is hygroscopic and may pick up moisture and carbon dioxide... view more
D.E.H.™ 860 by Olin is an aqueous polyamide solution. Acts as a curing agent. It has emulsification capability. D.E.H.™ 860 is suitable for impregnation and sealing of concrete substrates... view more
Applications
D.E.N. 431 by Olin is an epoxy novolac resin [with multi-epoxy functionality (± 2.8)]. Exhibits high chemical resistance and excellent elevated temperature performance. Suitable for applications... view more
Applications
D.E.N.™ 438 by Olin is a semi-solid reaction product of epichlorohydrin and phenol-formaldehyde novolac. Used in adhesives and in high temperature applications. D.E.N.™ 438 produces tightly... view more
Applications
Standard semi-solid reaction product of epichlorohydrin and phenol-formaldehyde novolac. Used for high temperature applications. Produces tightly cross-linked cured systems. Can be used alone or in... view more
Applications
Reaction product of epichlorohydrin with bisphenol-A and bisphenol-F. Offers crystallisation resistance. Compatible with common liquid epoxy resins. Can be blended with other materials (diluents... view more
D.E.R.™ 317 by Olin is a bisphenol-A epoxy resin. Exhibits high viscosity, is fast reacting. Suitable for adhesive applications requiring quick gelling with amine curing agents... view more
Applications
D.E.R.™ 321 by Olin is diglycidylether of bisphenol A/CGE. It is a low viscosity resin allowing large amounts of fillers. Its cure rate is similar to undiluted resins with improved acid... view more
D.E.R.™ 324 by Olin is an aliphatic glycidyl ether modified bisphenol-A based liquid epoxy resin. It has a lower surface tension than other reactive diluent modified liquid epoxy resins. It... view more
Applications
Reactive diluent modified product of epichlorohydrin with bisphenol-A. Possesses low surface tension. Offers good surface wetting and adhesion. Provides increased acid resistance, pot-life and... view more
Applications
Reaction product of epichlorohydrin and bisphenol-A. Used in adhesives. Acts as a curing agent... view more
Applications
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