Typical Formulation Ingredients
Ingredient
Parts by weight
Polyamide resin (Versamid 940, BASF)
Paraffin wax (130°F melting point)
Tackifier (Staybelite Ester 10, Eastman Chemical)
Ethyltoulene sulfonamide plasticizer (Santicizer 8, Monsanto)
(Source: Adhesives Formulary Handbook, NIIR Board, Asia Pacific Business Press, Inc., 2010, p. 233)
Typical Properties
• Good adhesion to a wide variety of substrates
• Useful where blocking resistance is not an important concern
• Good low temperature flexibility
• Resistant to grease and water vapor
Resulting Properties
Polyamide hot melt adhesives have better heat resistance than EVA or SBC types and use fewer additives. Certain types of polyamide hot melts can withstand 200°C over the short term without degradation, although creep is generally a problem. Polyamide adhesives generally exhibit sufficient properties, such as tack, without the use of additives. However, the base polyamide resin generally costs more than more conventional hot melt resins that rely on formulation for optimum performance. It is important to minimize the time when the molten resin is exposed to oxygen.