DICYANEX®

Adhesives ingredients supplied by Evonik

5 products match your search

Product Name

Supplier

Description

Evonik

Dicyanex® 1200 by Evonik is a micronized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more

Applications

DICYANEX® 1400B

Evonik

Dicyanex® 1400B by Evonik is a micronized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more

Applications

Adhesives

DICYANEX® 1400F

Evonik

DICYANEX® 1400F by Evonik acts as a latent curing agent for epoxy resins. Provides easy variation of activation temperature from 180°C-95°C with appropriate accelerator selection. It is easily... view more

Applications

Adhesives

DICYANEX® 200-X

Evonik

Dicyanex® 200-X by Evonik is a dicyandiamide latent curing agent used for epoxy resins in solvent-based processes. It provides enhanced solubility in polar solvents. Dicyanex® 200-X is used in... view more

Applications

Polymers>Epoxies (EP)

DICYANEX® 325

Evonik

Dicyanex® 325 by Evonik is a pulverized grade of dicyandiamide. It contains 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing... view more

Applications

Polymers>Epoxies (EP)