The Free Database to Select all your Adhesives Ingredients

TAIPOL® 6014 by TSRC Corporation/ Dexco Polymers is a styrene ethylene butylene styrene (SEBS) copolymer with 18% styrene content and linear/medium molecular weight. With its hydrogenated structure... view more

VISIOMER® GLYFOMA by Evonik is glycerol formal methacrylate based low-odor reactive diluent. It is based on 38% of glycerol derived from renewable raw materials. It is characterized by its low... view more

Curamine 33-919 by Bitrez is a specially formulated low viscosity aliphatic ketamine curing agent developed for use in conjunction with liquid epoxy resins in adhesives. It exhibits low viscosity... view more

DELO-QUICK® 5975 by DELO is a high viscous, solvent-free activator which accelerates the adhesion build-up of metal adhesives such as DELO-ML. It contains a reddish fluorescent agent. It improves... view more

DELO-QUICK® 5910 by DELO is a low viscous, solvent-free activator for anaerobic adhesives. It is used for the pre-treatment of bonding surfaces to accelerate curing of DELO-ML. It also enhances the... view more