Typical Formulation Ingredients
Phase
Ingredient
Parts by weight
A
Epoxy resin, EEW=190 (Npel 128, Cardolite)
A
Diluent (Cardolite® NX-2026, Cardolite)
A
Air release additive (BYK® -A 501, BYK)
A
Clay (Betone® 27, Elementis)
A
Portland cement, PO 42.5R
B
Phenalkamine curing agent (Cardolite® NX-8101, Cardolite)
B
Air release additive (BYK® -A 501, BYK)
B
Silica (Silverbond 602, Sibelco)
Typical Properties
Compressive strength at max, MPa
Resulting Properties
Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications.
These aggregate-filled formulations illustrate the use of epoxy resins to impart thermal compatibility with exterior concrete applications including patching of slab and joint spalls, skid-proofing loading docks and ramps, crack sealing and waterproofing, grout bonding of pre-cast concrete supports, and grouting of recessed electrical wiring, posts, tie-down fixtures, etc.