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Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Flexible Epoxy Adhesive for Potting and Impregnating Electrical Components by Momentive

Adhesives Formulation | Supplied by Momentive Performance Materials

Applicable Base Polymer Properties

Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications.

Typical Formulation Ingredients

Phase
Ingredient
Parts by weight
Epoxy resin (Epon™ 826, Momentive) 
xx 
Toughener (Heloxy™ Modifier 32, Momentive) 
xx 
Dodecenylsuccinic Anhydride (Allied Chemical Corp.) 
xx 
Lithium Stearate #304, (Witco Chemical Corp.) 
xx 
Zinc Stearate Grade H (Metasap Chemical Co.) 
xx 

Typical Properties

Properties
Viscosity at 23°C, cps 
xxx 
Cure schedule 
xxxxxxxxxxxx 
Tensile strength, psi 
xxxx 
Elongation, % 
xx 
Izod impact strength, ft-lb/in 
xxxx 
Water absorption, 24 hrs @ 77°F 
xxxx 
Dielectric constant at 23°C for 60 Hz 
xxxx 
Dissipation (power) factor at 23°C for 60 Hz 
xxxxx 
Volume resistivity, ohm-cm 
xxxxxxxx 

Processing

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Resulting Properties

This single package epoxy/anhydride compound utilizes HELOXY Modifier 32 as a low viscosity flexibilizer for thermal shock resistance and metallic stearates as latent catalysts. The combination of lithium and zinc stearates eliminates surface tack but retains long shelf life and provides good electrical insulating properties at temperatures up to 130 °C. The low volatility of all components permits the use of a high vacuum to insure complete impregnation and absence of air voids.

Tips and Tricks

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