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Adhesives Ingredients
The material selection platform
Adhesives Ingredients

General Purpose Epoxy-Mercaptan Adhesive by Cognis

Adhesives Formulation

Applicable Type
Applicable Base Polymer
Applicable Industrial Sectors

Applicable Base Polymer Properties

The polymercaptans can be used to cure epoxy resin systems quickly. The primary advantages of epoxy adhesives cured with mercaptan curing agents are the following:

  • Rapid Cure of Epoxies
  • Low-Temperature Cure
  • Thin-Film Cure
  • Low Toxicity
  • Light Color
  • Excellent Adhesion
  • 1:1 mix ratio – not critical
  • Acceleration ability with other curatives, e.g. amines, polyamides, anhydrides, etc.
  • Typical Formulation Ingredients

    Phase
    Ingredient
    Parts by weight
    Epoxy novolac resin (Epoxy equivalent weight 176-181, 20000-50000 cps at 52°C) 
    xx 
    Epoxy resin (Epoxy equivalent weight of 177-188, 7000-10000 cps at 25°C) 
    xx 
    Diglycidyl ether of 1,4-butanediol or diglycidyl ether of cyclohexanedimethanol or other diepoxide diluent 
    xx 
    Mercaptan (Capcure WR-6, Cognis) 
    xx 

    Typical Properties

    Properties
    Mix ratio by weight, Part A : Part B 
    xxxxxx 
    Gel time (0.3 inch thick) at 25 ° C mins 
    x 
    Gel time (0.3 inch thick) at 4 ° C mins 
    xx 
    Gel time (0.05 inch thick) at 25 ° C mins 
    xx 
    Gel time (0.05 inch thick) at 4 ° C mins 
    xx 
    Maximum exotherm (0.3 inch thick), °C 
    xxx 
    Tensile strength, psi 
    xxxx 
    Elongation, % 
    xxx 
    Heat distortion temperature, °C 
    xx 

    Processing

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    Resulting Properties

    These adhesives are rapid curing epoxy adhesives processing variable viscosity depending on the filler concentration. The bond will set to a handling strength in approximately 5 mins at room temperature and will develop greater than 1,000 psi tensile shear strength in approximately several hours. Practical cure rates can be achieved at temperatures as low as 4°C. The major disadvantages of mercaptan curing agents are their odor, skinning, and low heat deflection temperature.

    Tips and Tricks

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