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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients

Low Temperature Curing Epoxy Adhesive

Adhesives Formulation

Applicable Type
Applicable Base Polymer
Applicable Industrial Sectors

Applicable Base Polymer Properties

Because of their thermosetting molecular structure, epoxy adhesives exhibit excellent tensile-shear strength but poor peel strength unless modified with a more resilient polymer. Epoxy adhesives offer excellent resistance to oil, moisture, and many solvents. Low shrinkage on curing and high resistance to creep under prolonged stress are characteristics of many high quality epoxy adhesives. Epoxy resins have no evolution of volatiles during cure and are useful in gap-filling applications.

Typical Formulation Ingredients

Ingredient
Parts by weight
Part A: 
 
Epoxy resin (Epon 8111, Momentive Specialty Chemicals) 
xxxxx 
Filler (Cab-O-Sil M5, Cabot Corp.) 
xxx 
Part B: 
 
Amine curing agent (Epikure Curing Agent 3271, Momentive Specialty Chemicals) 
xxxx 
(Source: Momentive Specialty Products) 
 

Typical Properties

Properties
Mix ratio (A:B) by weight 
xxxxxx 
Viscosity resin at 25°X, cps 
xxxxx 
Viscosity curing agent at 25°C 
xxx 
Gel time 100 gms 
 
- at 25°C, mins 
x 
- at -22°C, mins 
x 
Tensile-shear strength (aluminum to aluminum), psi 
 
after curing 7 days at 25°C 
xxxxx 
after curing 3 days at -22°C 
xxx 

Processing

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Resulting Properties

This adhesive is a rapid curing, unfilled epoxy / amine adhesive processing light color. Practical cure rates are achieved at temperatures as low as 4°C. A mild, non-offensive odor and nonfuming characteristics are other features of this adhesive.

Tips and Tricks

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