Energy savings plus mechanical reinforcement and rheology control

Low Viscosity, Low Temperature Curing 2K Epoxy Adhesive

Adhesives Formulation

Applicable Type

Reactive Adhesives , Epoxy Adhesives

Applicable Base Polymer

Epoxies (EP)

Applicable Industrial Sectors

Buildings & constructions , Electrical & Electronic Bonding , Industrial Assembly , Transportation (excl. Automotive)

Applicable Base Polymer Properties

Epon Resin 8111 is a low viscosity resin displaying exceptionally rapid reaction rates with aliphatic amine curing agents over a broad temperature range while providing performance levels roughly equivalent to basic liquid epoxy resins. This unique feature suggests the use of Epon Resin 8111 in rapid set adhesives and patching compounds capable of satisfactory use at application temperatures to 0°C. Aliphatic amine cured Epon Resin 8111 systems are characterized by hard, tough cures exhibiting mechanical, electrical, and water resistance properties similar to those normally expected from conventional liquid epoxy resins.

Typical Formulation Ingredients

Phase

Ingredient

Parts by weight

Epoxy resin (Epon Resin 8111, Momentive)

xxxxx

Fumed silica (Cab-o-Sil M5, Cabot Corporation)

xxx

Epoxy curing agent (Epikure 3271, Momentive)

xxxx

Typical Properties

Properties

Mixed viscosity at 50 rpm, cps

xxxx

Gel time,100 gms, mins at:

25°C

-22°C

Shear strength, psi, after:

30 mins @ 25°C

90 mins @ 25°C

xxx

7 days @ 25°C

xxxx

Processing

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Resulting Properties

This formulation provides a low temperature curing adhesive having high viscosity. It will bond to a variety of substrates at temperatures of -10°C to 25°C. Suggested uses are as an anchoring system, adhesive for low temperature cure, and adhesive for rapid set applications. Its primary features include fast set time, low viscosity that permits easy dispensing, and a low temperature cure that allows for wide seasonal installation periods such as in the construction industry. (Source: Momentive)

Tips and Tricks

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