Typical Formulation Ingredients
Phase
Ingredient
Parts by weight
Part A
PolybutadieneGrade, Supplier Ricon 130MA20, Sartomer
Part A
Maleic anhydrideGrade, Supplier Lindride 12, Lindau Corp.
Part A
CatalystGrade, Supplier Byk A500, Byk Chemie
Part A
Catalyst Grade , Supplier Byk A515. Byk Chemie
Part B
Epoxy ResinGrade, Supplier DER 331, Dow Grade, Supplier DER 331, Dow
Part C
Grade, Supplier Name DAMA 1010
Resulting Properties
The above table presents typical three component epoxy adhesive formulations using polybutadiene with maleic anhydride as a toughening agent. The material is mixed 2:1 Part A : Part B by weight and then the DAMA 1010 is mixed into the formulation.
This epoxy system is claimed to provide a hydrophobic backbone, low viscosity, softness and high tensile strength and adhesion. Typical cured properties are:
Hardness | 75 Shore D |
Tensile Strength | 2650 psi |
Lap Shear Strength | 9350 psi |
Tg | 119°-127°C |
This adhesive formulation can cure at either room temperature or elevated temperatures. Tensile shear strength and temperature resistance of these adhesives are relatively high. Peel strength is also high and does not decrease rapidly with lower temperatures. The durability of polybutadiene modified epoxies is satisfactory as measured by most long term moisture tests.