TAGS: Sealants
The Adhesive and Sealant Council (ASC) announces new dates and location for the 10th World Adhesive and Sealant Conference (WAC). The expo is to be held from April 19-21, 2021 at the Hilton Chicago, Chicago, USA. The theme for 2021 expo is “Securing Our Future.” The Asia Regional Adhesive Council and FEICA, the Association of the European Adhesive and Sealant Industry, are serving as the co-hosts of the conference.
Unique and Impactful Event for Adhesive and Sealant Industry
The global conference, hosted by ASC was originally scheduled for April 2020 but was postponed due to the Covid-19. The conference is held once every four years and rotates between Asia, Europe, and North America.
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Because the World Adhesive and Sealant Conference is supported by and brings together the worldwide industry—manufacturers, suppliers, distributors, service providers, and academia—in one place over the course of three days, it is truly unique and impactful,” said Bill Allmond, ASC’s president. “There is no other conference like it.”
Latest Industry Developments Across the Globe
WAC 2021 will feature keynotes from the industry’s leading companies and a full two-day program with more than 90 speakers presenting on sustainability, adhesives and raw materials development, key feedstocks, global regulatory developments, market disruptors, end user business needs, mergers and acquisitions, among others. Each region—Asia, Europe, and North America—will provide unique viewpoint, providing attendees with a valuable opportunity to learn about the latest developments taking place across the globe.
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There will continue to be significant opportunities across our industry’s markets driven by innovation, efficiency improvements and strong leadership. With the future outlook somewhat uncertain, there will continue to be concerns about international trade, raw material costs, government regulations, as well as public health. These challenges are felt globally and require increased focus within our industry,” said Brian McSwigan, vice president of business development for packaging adhesives at Henkel Corporation and Chair of ASC.
Source: Adhesive and Sealant Council