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Bergquist Unveils Bond-Ply®, a Thermally-conductive, Heat Curable Laminating Adhesive

Published on 2014-08-21. Author : SpecialChem

Chanhassen, MN -- The Bergquist Company is excited to introduce the newest product in its Bond-Ply® silicone laminate adhesive line: Bond-Ply® LMS-HD. This thermally conductive, heat curable laminate material was designed to structurally adhere power components and PCB’s to a heat sink without the need for mechanical fasteners, such as clips and screws.

Bond-Ply® LMS-HD is made up of a high performance, thermally loaded low modulus silicone compound coated on a cured core and double lined with protective films. Its intrinsic isolation core provides high thermal performance and exceptional dielectric isolation. The low modulus silicone design effectively absorbs the mechanical stresses induced by assembly-level CTE mismatch, shock and vibration, while providing excellent thermal and dielectric performance plus adhesive strength.

About The Bergquist Company

The Bergquist Company is a leading global manufacturer of thermal materials and technologies used to dissipate heat and keep electronic components cool. Headquartered in Chanhassen, MN, it brings high standards and focused leadership, supplying such well recognized names as Gap Pad®, Gap Filler, Sil-Pad®, Bond-Ply®, Hi-Flow® and Thermal Clad® to the electronic industry. Bergquist builds on its innovative abilities to bring new solutions to market, radically helping to shape the growing thermal market with highly-filled liquids and high-performance polymer materials. Using its advanced technology, skilled teams of Bergquist chemists, scientists and engineers collaborate with customers worldwide to create and provide the crucial support and solutions necessary for next-generation products. The current portfolio includes a vast range of products in consumer, computer, automotive, lighting, telecom, medical and military applications.

Source: The Bergquist Company


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