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Bodo Möller Chemie Partners with Henkel for Electronics Industry

Published on 2023-06-01. Edited By : SpecialChem

Bodo Möller Chemie Partners with Henkel for Electronics Industry The Bodo Möller Chemie Group is expanding its cooperative partnership with manufacturer Henkel Adhesive Technologies. The special chemicals experts are now also distributing to Belgium, Luxembourg and the Netherlands. In doing so, they will be focusing on products for electrical and electronic applications as well as for e-mobility, sensors, lighting, rail and aerospace.

This includes the complete Bergquist product range of thermally conductive materials. In this way, the entire value chain for thermally conductive solutions will be covered – from selecting the technically most suitable material through to cutting and the production and logistics chain.

Adhesive Solutions Portfolio for Electronics Industry


With the extended collaboration with Henkel, Bodo Möller Chemie now also offers a complete adhesive solutions portfolio for the electronics industry with renowned brands Loctite and Bergquist. Products range from potting compounds and electrically conductive adhesives through to underfills and thermally conductive solutions. Bodo Möller Chemie is thus further consolidating its international position as a distributor and application specialist on the adhesive solutions market.

We are delighted with our extended collaboration with Henkel,” said Cedric De Ryck, head of sales at Bodo Möller Chemie Benelux. “The partnership strengthens the relationship between Henkel and the Bodo Möller Chemie Group. It ensures that we can continue to offer our clients premium solutions for their electronic applications.”

Gaining Foothold in Benelux


Both manufacturers and customers benefit from the Bodo Möller Chemie Group’s consultation services offering guidance on selecting the optimum solution for their application. For thermal interface materials (TIM), Bodo Möller Chemie’s own Cutting Competence Center is able to cut and imprint thermally conductive material in a single work step.

The components are then tested and measured optically with a measuring microscope. During this process, virtually any contour and contour adjustment can be made as required thanks to digital cutting. Clients benefit from the supply of ready-to-use products such as Thermal GAP PAD®, Thermal SIL PAD®, Hi Flow phase change materials and Bond Ply, a double-sided adhesive solution for thermally stressed bonding. In addition to pre-plotted products, liquid materials are also available as thermal gap fillers.

With these services, we’re further expanding our portfolio together with Henkel in a significant way and gaining a foothold in Benelux,” added Frank Haug, chairman of the Bodo Möller Chemie Group executive management. “Henkel is the ideal partner for offering users a complete solutions portfolio from a single source.”

Source: Bodo Möller Chemie Group


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