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Ceramabond™ 618-N Bonds Porous & Low Expansion Ceramics To 3000 °F

Published on 2009-09-23. Author : SpecialChem

Ceramabond™ 618-N, a new high temperature, silica-based ceramic adhesive developed by Aremco Products, Inc., is now used to bond porous and low expansion ceramics, glass and quartz for applications to 3000 °F (1650 °C).

CERAMABOND™ 618-N BONDS POROUS & LOW EXPANSION CERAMICS TO 3000 °F

FEATURES

Ceramabond™ 618 is a single part, phosphate-bonded, silica-filled ceramic compound, which provides exceptional adhesion to low expansion ceramics, quartz and glass, as well as molybdenum and tungsten metals. This adhesive offers temperature resistance to 3000 °F (1650 °C), a dielectric strength of 250 volts per mil and a volume resistivity of 109 ohm-cm at room temperature. Ceramabond™618-N also offers excellent resistance to oxidation and most acids and alkalis.

Ceramabond™ 618-N is an inorganic, water-dispersible system that is easily dispensed by brush or syringe and fully cures in 1-2 hours at 700 °F. It also sinters and strengthens further as it is exposed to temperatures above 1000 °F. In the uncured state, Ceramabond™618-N can be cleaned easily with warm water and soap.

Typical uses for Ceramabond™ 618-N are in the assembly of porous ceramic filters, quartz infrared heaters, and various instruments such as temperature probes, strain gauges, oxygen analyzers, gas chromatographs, and mass spectrometers. This product is available from stock in packages from 4-oz jars to 5-gallon pails.

Source: Aremco


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