Industry News

Henkel Introduces Advanced Hotmelt Technomelt Supra 1000 Adhesive

Published on 2012-06-13. Author : SpecialChem

With its extreme bonding performance and compatibility with a wide range of materials, the new packaging hotmelt Technomelt Supra 1000 from Henkel brings a new level of efficiency to packaging production. The hotmelt owes its strong bonding power to an innovative base polymer that not only significantly improves processability and efficiency, but also reduces adhesive usage.

The most important requirements for the use of hotmelt adhesives in the packaging industry are high mileage, productivity and availability. In addition to its bonding performance, Technomelt Supra 1000 can also be used with a larger range of materials and provides better flowability in automatic filling systems.

Reliable supply thanks to worldwide supply capabilities

"After obtaining excellent results in customer line trials lasting several months that confirmed its outstanding quality and performance capability, we are now launching the global rollout of this product," says Jean Fayolle, Corporate Senior Vice President Consumer Goods and Construction Adhesives at Henkel. To manufacture this innovative adhesive technology, Henkel developed and implemented a completely new production and process technology that is unique in the industry.

Compared with metallocene-based hotmelts, the new and innovative base polymer in Technomelt Supra 1000 reduces adhesive usage by up to 20 percent, while the savings are even greater - up to 40 percent - by comparison with EVA-based hotmelts. "At the same time, we can also assure continuity of supply to our customers, which is a great advantage considering the current volatility of raw materials markets," emphasizes Fayolle.

Easier machine cleaning

Unlike conventional granulated adhesives, Technomelt Supra 1000 is crystal-clear and therefore excels not only in terms of performance but also through its visual appeal. The adhesive is almost invisible on the package. The product provides as well excellent adhesive flow properties, without any stringing or cracking.

Technomelt Supra 1000 makes machine cleaning easier, since adhesive residues can be easily removed from metal parts. The novel granules also improve flowability in automatic filling systems. A further plus of the new Supra 1000 is its good heat resistance, assuring safe transport of packages even to regions with hot climates.

Technomelt Supra 1000 helps to improve sustainability performance

Henkel has also been able to substantially expand the range of uses for this new hotmelt, thus making it suitable for a large variety of packaging applications. Being more resistant to etheric oils, for example, it can be used to make packaging for tea or chewing gum. Compared to conventional hotmelts, Technomelt Supra 1000 is offering higher thermal stability and shows good cold flexibility, making it just as suitable for hot-filled packages as deep-freeze ones.

In addition to its technical performance features, Technomelt Supra 1000 also helps customers to improve their environmental performance. Much less adhesive is needed for the same volume of packages produced. Moreover, less waste is generated as the quality of the adhesive reduces the reject rate in production.

By launching this next generation packaging hotmelt family as strong part of its Technomelt Supra product range, Henkel combines innovation with sustainability leadership and continues its dedicated support towards the packaging industry.

About Henkel

Henkel operates worldwide with leading brands and technologies in three business areas: Laundry & Home Care, Cosmetics/Toiletries and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel, headquartered in Düsseldorf / Germany, has some 47,000 employees worldwide and counts among the most internationally aligned German-based companies in the global marketplace

Source: Henkel

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