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Master Bond Develops Epoxy Adhesives for Applications Requiring Flexible Impact Resistance Bonds

Published on 2011-03-25. Author : SpecialChem

HACKENSACK, NJ -- For demanding applications where highly flexible, impact resistant bonds are required, Master Bond developed Polymer System EP37-3FLF. This optically clear, two component epoxy has exceptional resistance to cryogenic temperatures and severe thermal cycling. Its low exotherm also makes it a superb potting, encapsulating and casting system, especially where wider cross section thicknesses are specified. Its unique combination of properties allows it to cure without stressing delicate electronic components.

EP37-3FLF

Serviceable over the wide range of 4K to 250°F, EP37-3FLF cures at room temperature in 2 to 3 days or faster at elevated temperatures. This epoxy offers a convenient, non-critical 1 to 1 mix ratio by weight or volume, and a low mixed viscosity of 1,400 to 1,500 cps. Additionally, users can work with a 100 gram mass of the adhesive at room temperature for up to 90 minutes. EP37-3FLF has a bond shear strength exceeding 2,000 psi and a T-peel strength of 25 pli. This flexible epoxy has an elongation of 180% and superior electrical insulation properties with a volume resistivity of 1x1014 ohm-cm. It bonds well to a variety of substrates including metals, glass, ceramics, rubbers and many plastics and is widely used in the optical, electrical, electronic, computer and OEM industries.

EP37-3FLF is sold in pint, quart, gallon and 5 gallon container kits and has a 6 month shelf life if unopened and stored at room temperature.

Master Bond Low Stress Epoxies

Master Bond's EP37-3FLF is a highly flexible, room temperature curing epoxy designed for high performance applications in many industries across a wide service temperature range.

Source: Master Bond


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