Industry News

TechFilm Offers Adhesive Designed for Bonding Gold Substrates

Published on 2004-08-18. Author : SpecialChem


E2213F is a new high-performance, electrically conductive B-staged film adhesive capable of bonding to gold or gold-plated substrates.

This product is suited for EMI/RF grounding applications and meets ASTMD 3850 for space-simulated outgassing, as well as MIL STD 883 section 3.8.51 for TGA outgassing. E2213F is available as a preform or in sheet form up to 12" square.

TechFilm is a leading manufacturer of epoxy adhesive films and performs. The epoxies are B-staged thermoplastic or thermosetting materials that are available both supported and unsupported. Other materials utilized include epoxy/urethane, thermoplastic polyester and polyimide thermosetting resins.

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