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Henkel Unveils Technomelt TC 50, a Thermally Conductive Material

Published on 2016-06-01. Author : SpecialChem

In Europe, Henkel recently made a debut of thermally conductive low pressure molding Technomelt material, Technomelt TC 50. The novel encapsulation and heat dissipating hot melt adhesive is one of several thermal management solutions.


Following its successful North American launch earlier this year, Henkel brings Technomelt TC 50 to the European electronics. The new low pressure molding system maintains all of the benefits of award-winning Technomelt materials, while incorporating heat dissipation functionality.
Henkel Unveils TC 50, a Thermally Conductive Technomelt Material
Fig. 1: Henkel Unveils TC 50, a Thermally Conductive Technomelt Material

Benefits of Technomelt TC 50:


• Delivers a thermal conductivity of more than 0.5 W/m-K, allowing heat generated by the assembly to dissipate through the Technomelt material. Ideal for applications such as LED drivers, automotive electronics, solar inverters, camera modules and power supplies,
• Enables a simple, three-step, single material overmold process that is compatible with delicate, fine-pitch assemblies and provides watertight encapsulation for protection from a variety of environmental influences.
• Offers thermal management and protection in a single material

Loctite TCP Phase Change TIMs

For managing the requirements of power devices including CPUs, IGBTs and discrete components, Henkel’s Loctite TCP Phase Change thermal interface materials (TIMs) offer a highly-effective alternative to conventional greases, providing performance, long-term reliability and processing advantages. Loctite TCP materials have the ability to cope with the higher power densities of certain applications, exhibit low in-package thermal resistance, and effectively manage higher operating temperatures over extended periods of use. In addition to their impressive thermal management capabilities, Loctite TCP Phase Change materials enable process and design flexibility. The materials can be dispensed or screen printed in infinite patterns, thicknesses and areas for an automated, high throughput and adaptable operation. Loctite TCP products remain in a dried state until melting at their designated phase change temperature, which allows them to also be used as a pre-applied solution. They are more reliable as compared to greases, which have a tendency to migrate or “pump out” over time, limiting thermal performance.

Proven Thermal Clad Insulated Metal Substrates

Applications with high watt densities and high currents are well-suited for Henkel’s proven Thermal Clad insulated metal substrates, which provide effective heat conduction and minimal thermal impedance as compared to traditional printed circuit boards (PCBs). The built-in thermal management capability of Thermal Clad substrates enables manufacturers to streamline designs through reduced PCB dimensions, extend die life, improve thermal and mechanical performance, and lower operating temperature. Thermal Clad substrates are successfully incorporated into numerous high power applications including LED lighting, power conversion, solid state relays and switches, and motor drives.

Loctite, Technomelt and Thermal Clad are registered trademarks of Henkel and/or its affiliates in Germany and elsewhere.

About Henkel

Henkel operates worldwide with leading brands and technologies in three business units: Laundry & Home Care, Beauty Care and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions, both in the consumer and in the industrial businesses, with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel employs about 50,000 people and reported sales of 18.1 billion euros and adjusted operating profit of 2.9 billion euros in fiscal 2015. Henkel’s preferred shares are listed in the German stock index DAX.

Source: Henkel


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