Indium Corporation® has expanded its portfolio of proven pastes with two new AuSn pastes designed for the higher processing temperatures and assembly needs required for use in high-power LED module array applications, such as automotive, infrastructure, and horticulture.
Higher Processing Temperatures
Indium Corporation produces a wide range of solder paste products to meet the current and evolving needs of the industry. High-power LEDs have the ability to provide much higher levels of light output than traditional LEDs while also providing higher levels of performance, leading to a longer lifetime of the device. Due to the large amount of heat generated—in such a localized area—a high-melting and high-reliability solder is required for assembly.
It is also critical to the LED assembly process that the solder interface between the diode and its substrate is void-free in order to generate a stable transmission of light and allow for the transfer of the tremendous heat generated by the diodes to maintain the temperature stability of the device.
AuLTRA™ 3.2 and AuLTRA™ 5.1 are AuSn solder pastes specifically formulated to accommodate higher processing temperatures while providing high reliability.
AuLTRA™ 3.2 offers:
- Water-soluble flux
- Air or nitrogen reflow
- Superb wetting
- Low-voiding
- Long open life, reduced waste
AuLTRA™ 5.1 offers:
- No-clean residue
- Air or nitrogen reflow
- Superb wetting
- Low-voiding
- Long open life, reduced waste
Both pastes are offered in a variety of AuSn alloys and powder sizes. In addition to being ideal for use in high-power LED module array applications, AuLTRA™ 3.2 and AuLTRA™ 5.1 are applicable for all AuSn paste applications as their performance has been, and continues to be, proven in the field.
Source: Indium Corporation