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Master Bond Launches Heat-curable Epoxy Adhesive for Glob Top Systems

Published on 2018-11-29. Author : SpecialChem

TAGS:  Epoxy Adhesives    

Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency ideal for glob top, chip coating and bonding applications.

High-strength Bonds to Variety of Substrates

MasterBond-epoxy-nasa
Master Bond EP17HTND-CCM is a new single component
epoxy that is not premixed and frozen, meets NASA low
outgassing specifications and thermally conductive

EP17HTND-CCM meets NASA low outgassing specifications and is serviceable from -80°F to +600°F [-62°C to +316°C]. This adhesive forms high strength bonds to a wide variety of similar/dissimilar substrates such as:
  • Metals
  • Ceramics
  • Plastics
  • Composites
  • Circuit board materials

Ability to Resist Many Chemicals


EP17HTND-CCM is thermally conductive and electrically non-conductive even upon exposure to hostile environmental conditions. EP17HTND-CCM has a high volume resistivity of more than 1015 ohm-cm at 75°F and over 1012 ohm-cm at 400°F. Its thermal conductivity is 9-10 BTU•in/ft2•hr•°F [1.4423 W/(m•K)] at 75°F.

Also noteworthy is its ability to resist many chemicals including acids, bases, salts, fuels, oils and many solvents.

Readily Curable with Low Exotherm


Formulated for various electronic applications, EP17HTND-CCM cures readily in 1-2 hours at 350°F [175°C] with a relatively low exotherm upon curing. It can be dispensed from a syringe, either manually or with an automatic dispenser. Master Bond EP17HTND-CCM is available for use in common size syringes ranging from 10 cc to 30 cc. For storage simple refrigeration at 40-45°F is recommended.


Source: Master Bond
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