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Master Bond’s New Low-cure Thermally Conductive Epoxy Adhesive for Electronics

Published on 2020-11-10. Author : SpecialChem

TAGS:  Epoxy Adhesives    

Master Bond Introduces Epoxy for Bonding and Small Encapsulation Applications Master Bond launches Master Bond EP4EN-80, a NASA low outgassing approved epoxy adhesive for the electronics industry. The epoxy can be cured at temperatures as low as 80°C, unlike conventional one component heat curing systems. Master Bond EP4EN-80 features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents.

Suitable for Potting Applications

Free flowing Master Bond EP4EN-80 is suitable for bonding, and for small potting and encapsulations up to about a quater inch thick in some applications. Due to its ultra-fine particle size filler material this system offers unique gap filling and heat transfer capabilities.

Master Bond EP4EN-80 has a thermal conductivity value of 0.75-0.85 W/(m•K) and electrical insulation with a volume resistivity of more than 1014 ohm-cm at room temperature. When used as an adhesive, Master Bond EP4EN-80 can be applied in thicknesses as thin as 10-15 microns.

High Tensile Modulus with RoHS Compliant

Master Bond EP4EN-80 provides notable strength properties including a compressive strength of 24,000-26,000 psi and an ultra-high tensile modulus of 1,200,000-1,400,000 psi at room temperature. It is serviceable over the temperature range of -50°C to +150°C.

Master Bond EP4EN-80 bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. It effectively resists waters, oils and fuels. This compound is gray in color and is RoHS compliant. Packaging is available in half pint, pint, quart and gallon sizes.

Source: Master Bond
Low molecular weight polyolefin
For stronger adhesives stick to Nynas
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