TAGS: Sealants Epoxy Adhesives
Master Bond launches Master Bond EP21NS, a two-part epoxy used for bonding, coating, sealing and potting/encapsulating. The epoxy has a nanosilica filler that imparts dimensional stability and abrasion resistance. Master Bond EP21NS exhibits a very low weight loss of 25 mg when measured according to ASTM D4060, standard test method for abrasion resistance, with CS-17 wheel for 1,000 cycles.
Offers Electrical Insulation with Volume Resistivity
The formulation is a reliable electrical insulation with a volume resistivity greater than 1015 ohm-cm, a dielectric constant of 2.6 at 16.4 GHz and a dielectric strength of 450 volts/mil at 75°F, for a 1/8th inch thick specimen. The product is serviceable over the temperature range of -80°F to +250°F.
Master Bond EP21NS has a long working life and good flow properties with a moderate mixed viscosity of 50,000-90,000 cps. The mix ratio of Master Bond EP21NS is 1 to 1 by weight, and its optimal cure schedule is overnight at room temperature followed by 4 to 5 hours at 150°F. The epoxy adhesive features very low shrinkage upon curing, a low coefficient of thermal expansion of 30-35 x 10-6 x in/in/°C and a compressive strength of 16,000-18,000 psi.
The formulation bonds well to a variety of substrates including metals, composites, glass, ceramics, rubbers and many plastics. Master Bond EP21NS is resistant to water and salts. The product is packaged in ounce kits, half pint kits, pint kits, and quart kits. The color of Part A is translucent and Part B is amber. Master Bond EP21NS does not contain solvents and is RoHS compliant.
Source: Master Bond