TAGS: Epoxy Adhesives
Master Bond launches Master Bond EP3HTS-TC a one part, NASA low outgassing rated epoxy, with thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C] and has an unlimited working life at room temperature.
Offers High-heat Transfer Capability
The material features a thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or manual syringes and can be applied without any tailing. Primarily, it is formulated for use as a die attach and special purpose bonding material.
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Master Bond EP3HTS-TC utilizes a non-sintering silver technology to provide ultra-high heat transfer capability,” said Rohit Ramnath, senior product engineer. “
It is designed without compromise to dispensability or adhesion strength, while maximizing performance properties.” Master Bond EP3HTS-TC is electrically conductive, with a volume resistivity of less than 1x10-6 ohm-cm.
Adheres to Variety of Substrates
The epoxy system exhibits good dimensional stability, resists thermal cycling, and has a low coefficient of thermal expansion of 20-23 x 10-6 in/in/°C. Die shear strength is 9-12 kg-f at 75°F for a 2 x 2 mm [80 x 80 mil] area.
It has a glass transition temperature of 58°C and is serviceable over the temperature range of -80°F to +400°F. This compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials and many plastics. Packaging is available in syringes, 20, 50 and 100 gram jars, as well as single and multiple pound containers.
Source: Master Bond