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Master Bond Launches Thermally Conductive Epoxy for Potting Applications

Published on 2020-08-21. Edited By : SpecialChem

TAGS:  Epoxy Adhesives    

Master Bond Launches Thermally Conductive Epoxy for Potting ApplicationsMaster Bond launches Master Bond EP29LPAOHT, a two component, NASA low outgassing approved epoxy system. The epoxy system features long working life of 8-10 hours per 1000 g batch. The low exotherm and flowable consistency of the epoxy is suitable for specialty potting applications where large masses of epoxy need to be cured.

High-thermal Conductivity with Electrical Insulation


Master Bond EP29LPAOHT can be mixed and poured in volumes of more than a gallon at a time. Even in deep cross section thicknesses, the product does not generate much heat. The epoxy does not start gelling quickly and is suitable for use in many production environments that require a long open time after mixing.

The epoxy system has a 100 to 50 mix ratio by weight and a mixed viscosity of 10,000-30,000 cps. Master Bond EP29LPAOHT possesses a high thermal conductivity value of 0.87-1.15 W/(m•K), and is electrically insulative with a volume resistivity of more than 1015 ohm-cm. Upon curing the product exhibits low shrinkage, dimensional stability and a low coefficient of thermal expansion. Master Bond EP29LPAOHT has a compressive strength of 24,000-26,000 psi, a Shore D hardness of 80-90 and a tensile modulus of 450,000-500,000 psi. The epoxy is serviceable over the wide temperature range of -60°F to +350°F.

Master Bond EP29LPAOHT bonds well to a variety of substrates including metals, glass, ceramics and many different plastics. The product resists many chemicals including, but not limited to, water, fuels and oils. The epoxy is available for use in half pint, pint, quart and gallon container kits. Master Bond EP29LPAOHT does not contain solvents and is RoHS compliant.


Source: Master Bond
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