The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
Product News

Master Bond Unveils Silver-filled Silicone Adhesive for Electronics

Published on 2024-05-14. Edited By : SpecialChem

Master Bond Unveils Silver-filled Silicone Adhesive for ElectronicsMaster Bond launches MasterSil 323S-LO, an additional cured silicone adhesive that is electrically and thermally conductive. This ASTM E-595 low-outgassing-rated product is designed for bonding applications where low stress is critical and is appropriate for use in vacuum environments.

It can be utilized in the aerospace, electronics, optoelectronics and specialty OEM industries.

Withstand Aggressive Thermal Cycling

MasterSil 323S-LO offers flexibility and toughness, with a Shore A hardness of 35 to 55, a low tensile modulus of less than 800 psi and an elongation of 50-100%, measured at 75°F. This enables it to withstand aggressive thermal cycling and mechanical shock, while offering a wide service temperature range from -80°F to +400°F [-62°C to +204°C].

MasterSil 323S-LO is a silver-filled adhesive that has a volume resistivity of less than 0.003 ohm-cm and a thermal conductivity of 9-11 BTU•in/(ft2•hr•°F) [1.30-1.59 W/(m•K)] at room temperature. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, rubbers as well as many types of plastics.

MasterSil 323S-LO has an easy to use 1:1 mix ratio by weight. The system features a paste consistency with minimal flow and does not rely on humidity access for curing. This formulation offers a variety of cure schedules at elevated temperatures, including 4 to 6 hours at 160-180°F, and 2 to 3 hours at 190-210°F.

MasterSil 323S-LO is available for purchase in jars ranging from 20 gram kits to one pound kits.

Source: Master Bond

Back to Top