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Master Bond Launches Thermally Conductive Silicone for Sealing Applications

Published on 2022-10-17. Edited By : SpecialChem

TAGS:  Sealants    

Master Bond launches Thermally Conductive Silicone for Sealing ApplicationsMaster Bond launches MasterSil 323AO-LO, a two-component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic, opto-electronic and specialty OEM industries.

Flexible with Low-tensile Modulus


The system has a thermal conductivity of 1.15-1.30 W/(m•K). It is highly flexible with a low tensile modulus of 500-700 psi, an elongation of 50-60%, and a hardness of 70-75 Shore A. The combination of properties enables it to withstand aggressive thermal cycling and mechanical shock.

MasterSil 323AO-LO has a relatively high strength profile for a silicone with a tensile lap shear strength of 250-350 psi at room temperature. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, plastics, and other silicones without imparting residual stress when heat cured. Serviceability is from -65°F to +400°F [-54°C to +204°C].

Offers Various Cure Schedule Options


MasterSil 323AO-LO features a paste-like consistency, which allows it to also be used as a gap filling material where minimum flow after application is desired. This formulation offers a variety of cure schedule options, with the optimum being overnight at room temperature followed by 3-5 hours at 125-175°F. It does not require exposure to air for complete cross-linking.

MasterSil 323AO-LO has an easy to use 1:1 mix ratio and is available for purchase in standard containers or gun applicator kits making it convenient for manual or automated dispensing.

Source: Master Bond


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