Solvay expands its range of FusePly® chemical bonding technology with a second product, FusePly® 250, designed to bond composite structures at 250°F and higher. The new product complements the previous FusePly® 100 grade, introduced in 2018 which has now been renamed FusePly® 350 to reflect its compatibility with 350°F cure film adhesives.
Both grades offer step-change bonding performance and durability and can easily be integrated into existing manufacturing processes as an upgrade for traditional surface preparation methods.
Covalent Bonds Between Adhesives and Composite Structures
FusePly® is a breakthrough composite bonding technology resulting in covalent bonds between adhesives and composite structures. While it handles and processes like a conventional peel ply product, it creates a reliable chemically functionalized composite surface which eliminates time and labor intensive surface preparation steps and assembly processes.
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The reliability and robustness of bonded structures are a top priority for users of composites in safety critical applications in aerospace and other demanding markets,” said Stephen Heinz, VP research and innovation for Solvay’s global composite materials business unit. “
We developed FusePly®, a fundamentally new bonding approach, to meet the needs of leading aircraft OEMs and enable them to take full advantage of composites for lighter, stronger structures.”
FusePly® 250 will officially be launched at the upcoming CAMX Composites and Advanced Materials Expo in Atlanta from October 30 to November 02.
FusePly® is a registered trademark of Solvay.
Source: Solvay