3M™ Boron Nitride Cooling Filler Agglomerates CFA 50M

3M™ Boron Nitride Cooling Filler Agglomerates CFA 50M by 3M is a mixture of agglomerates, platelets and boron nitride clusters. It provides excellent heat transfer capabilities (through-plane), high filler loadings and isotropic thermal conductivity. Exhibits low density, temperature stability, low loss factor and chemical resistance. It is soft to adapt to the flexibility of the matrix. It is lightweight and offers high reflectivity & electrical insulation. It is gentle on tooling for compounding, extrusion and injection molding processes. 3M™ Boron Nitride Cooling Filler Agglomerates CFA 50M is suitable for thermally conductive adhesives and greases for bonding. It registered in conformance with REACH according to EC directive 1907/2006.