Energy savings plus mechanical reinforcement and rheology control

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Omicure® U-410M

Technical Datasheet | Supplied by Huntsman

Omicure® U-410M by Huntsman is micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of curing. It provides great degree of acceleration to epoxy/dicy formulations. Omicure® U-410M is suitable for encapsulation adhesives. Suggested use level of is < 5 phr.

Compatiblity with other products

Find products that are predicted to be compatible with Omicure® U-410M.

This list of compatible products is generated out of estimated HSP values. A practical determination of these HSP values would provide higher certainty.
Learn more about Hansen Solubility Parameters (HSP) and their use in predictive formulation.

Compatible Products

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Products with the same brand name

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Compatible Products Based on HSP Distance

HSP distance provides an indication of compatibility. It is based upon the “like seeks like” principle. The smaller the distance between ingredients, the more compatible they are predicted to be.

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