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Adhesives Ingredients

KUREHA Microsphere S2640

Technical DataSheet | Supplied by Kureha

KUREHA Microsphere S2640 is a thermally expandable microcapsule for sealants, caulks and heat activated adhesives. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. Fully expanded, the microsphere increases 3-5X its original diameter with a 80-120X increase in volume. It is compatible in both binder and fibrous materials and can be compressed during molding and rebound to the intended shape when the pressure is reduced. Under equal weight, KUREHA Microsphere S2640 renders better volumetric filling and is 30-85% lighter than alternative mineral additives. Through consistent and accurate particle size distribution, it offers low thermal conductivity to provide extremely efficient thermal barrier properties.

KUREHA Microsphere S2640 Product details

Product Type
xxxxxxxxxxxxxxxxxxx
Physical Form
Spheres
Product Status
xxxxxxxxxx
Applications/ Recommended for
  • xxxxxxxxx
  • xxxxxxxx
  • xxxxxxxxxxxxxxxxxxxxxxxxx

KUREHA Microsphere S2640 Properties

Property

Value & Unit
Test Condition
Test Method
Thermal start (Tstart)
xxx °C
Tmax
xxx °C
Particle size
xx µm
Expanded particle size
xxx µm
Expansion ratio
xxxxx
Expanded particle density
xxxxxxx g/ml
Last edited May 10, 2018
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