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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
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Technical Datasheet | Supplied by Lehmann & Voss
Finely micronized polyamide. Acts as a rheological additive. Its optimum performance is achieved at process temperatures between 50 and 60 °C. It is suitable for highly filled and gloss systems. Offers sag-control, good leveling, anti-settling and improved application properties. Used in solvent-free and solvent-borne formulations, specifically in medium polar formulations at extended process temperatures. Also used in putties.
Product Type
  • Rheology Modifiers / Viscosity Modifiers / Thickeners
  • Rheology modifiers / thickeners > > Polyamide
Chemical Composition
Physical Form
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