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EPICLON® HP-6000

Technical Datasheet | Supplied by DIC Corporation
EPICLON® HP-6000 by DIC Corporation is a flame retardant, high performance epoxy resin with naphthalene backcone. Provides low thermal expansion, ductility and flexible toughness. It improves hard and brittle properties. EPICLON® HP-6000 combines exceptionally good bonding properties and extremely small cure shrinkage. Shows resistance to heat and water. Designed for IC encapsulant applications.
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Product Type
Epoxies (EP)
Chemical Composition
Naphthalene based epoxy resin
Product Status
COMMERCIAL
Applications/ Recommended for
  • Adhesives
  • Electrical & Electronic Bonding > Poting & Encapsulating
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