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Adhesives Ingredients
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Epon™ Resin 834

Technical Datasheet | Supplied by Hexion
Bisphenol A based epoxy resin. Can be blended with other epoxy resins. Because of its higher molecular weight, it provides enhanced system reactivity, surface tack and cured resin toughness in comparison to liquid grade BPA epoxies, but reduces elevated temperature performance. Is semi-solid at room temperature, pourable at slightly elevated temperatures. Especially useful in applications requiring extra surface tack, cure speed or toughness but cannot tolerate additives or modifiers. Used in high toughness adhesives and laminating materials.
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Product Type
Epoxies (EP) > Bisphenol A-based
Chemical Composition
Bisphenol A based epoxy resin
Product Status
COMMERCIAL
Applications/ Recommended for
  • Adhesives
  • Sealants
Bio Based
No
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