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Adhesives Ingredients

Epon™ Resin 834

Technical DataSheet | Supplied by Hexion

Bisphenol A based epoxy resin. Can be blended with other epoxy resins. Because of its higher molecular weight, it provides enhanced system reactivity, surface tack and cured resin toughness in comparison to liquid grade BPA epoxies, but reduces elevated temperature performance. Is semi-solid at room temperature, pourable at slightly elevated temperatures. Especially useful in applications requiring extra surface tack, cure speed or toughness but cannot tolerate additives or modifiers. Used in high toughness adhesives and laminating materials.

Epon™ Resin 834 Product details

Product Type
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Chemical Composition
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Product Status
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Applications/ Recommended for
  • xxxxxxxxx
  • xxxxxxxx
Bio Based
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Epon™ Resin 834 Properties

Property

Value & Unit
Test Condition
Test Method
Density @ 25°C
xxx lb/gal
Last edited Dec 18, 2017
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