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Adhesives Ingredients
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Product Name
Supplier
Description
Pioloform BM 18
Wacker
Pioloform BM 18 by Wacker is polyvinyl butyral resin produced by a reaction between polyvinyl alcohol and butyraldehyde. Compatible with a number of plasticiziers based on esters of phthalic acid...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Pioloform BS 18
Wacker
Pioloform BS 18 by Wacker is polyvinyl butyral resin produced by a reaction between polyvinyl alcohol and butyraldehyde. Pioloform BS 18 is used as a binder in phenolic adhesives and sealants...
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Applications
Adhesives
Sealants
VINNAPAS® RE 5010 N Discontinued
Wacker
Solvent-free, plasticizer-free, film-forming aid-free, water-redispersible vinyl acetate-ethylene copolymer powder. Used for blending with inorganic binders such as cement, anhydrite, gypsum and...
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Applications
Adhesives
Sealants>Putty
VINNAPAS® RE 5028 N Discontinued
Wacker
Solvent-free, plasticizer-free, film-forming aid-free, water-redispersible vinyl acetate-ethylene copolymer powder. Used for blending with inorganic binders such as cement, anhydrite, gypsum and...
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Applications
Adhesives
Sealants>Putty
VINNAPAS® RI 551 Z Discontinued
Wacker
Solvent-free, plasticizer-free, film-forming aid-free, water redispersible ethylene/vinyl laurate/vinyl chloride terpolymer powder. Used in conjunction with inorganic binders such as cement...
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Applications
Adhesives
Sealants>Putty
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