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Description
LUCKAMIDE EA-330
DIC Corporation
LUCKAMIDE EA-330 by DIC Corporation is a general purpose, solvent-less, polyamide amine grade. Acts as a curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE EA-330 is used...
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Applications
Adhesives
Polymers>Epoxies (EP)
LUCKAMIDE F4
DIC Corporation
LUCKAMIDE F4 by DIC Corporation is a general purpose, mannich-type modified aliphatic polyamine grade. Acts as a curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE F4 is...
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Applications
Adhesives
Polymers>Epoxies (EP)
LUCKAMIDE TD-960
DIC Corporation
LUCKAMIDE TD-960 by DIC Corporation is a general purpose, solvent-less, polyamide amine grade. Acts as a fast curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE TD-960 is...
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Applications
Adhesives
Polymers>Epoxies (EP)
LUCKAMIDE TD-961
DIC Corporation
LUCKAMIDE TD-961 by DIC Corporation is a solvent solution of polyamide adduct. Acts as a curing agent. Exhibits chemical resistance with drying characteristics. Shows compatibility with room...
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Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
LUCKAMIDE TD-977
DIC Corporation
LUCKAMIDE TD-977 by DIC Corporation is a solvent solution of polyamide amine adduct grade with drying characteristics. Acts as a curing agent. Shows compatibility with room temperature epoxy resin...
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Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
LUCKAMIDE TD-982
DIC Corporation
LUCKAMIDE TD-982 by DIC Corporation is a solvent-free, polyamide amine grade. Acts as a curing agent for room temperature epoxy resin. It is useable for long period of time. TD-982 is used as an...
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Applications
Adhesives
Polymers>Epoxies (EP)
LUCKAMIDE TD-984
DIC Corporation
LUCKAMIDE TD-984 by DIC Corporation is a solvent-less, polyamide amine grade. Acts as a curing agent. It is useable for long period of time. Shows compatibility with room temperature epoxy resin...
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Applications
Adhesives
Polymers>Epoxies (EP)
LUCKAMIDE TD-992
DIC Corporation
LUCKAMIDE TD-992 by DIC Corporation is a solvent solution of polyamine adduct with drying characteristics. Acts as a curing agent for room temperature epoxy resin. LUCKAMIDE TD-992 is diluted with...
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Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
LUCKAMIDE WH-614
DIC Corporation
LUCKAMIDE WH-614 by DIC Corporation is a mannich-type modified aliphatic polyamine grade with bonding properties. Acts as a curing agent for room temperature epoxy resin. LUCKAMIDE WH-614 is used as...
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Applications
Adhesives
Polymers>Epoxies (EP)
LUCKAMIDE WH-650
DIC Corporation
LUCKAMIDE WH-650 by DIC Corporation is a high strength, modified aliphatic polyamine grade. Acts as a fast curing agent. Shows compatibility with room temperature epoxy resin. LUCKAMIDE WH-650 is...
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Applications
Adhesives
Polymers>Epoxies (EP)
LUCKAMIDE WN-405
DIC Corporation
LUCKAMIDE WN-405 by DIC Corporation is a mannich-type modified aliphatic polyamine grade. Acts as a fast curing agent for room temperature epoxy resin. LUCKAMIDE WN-405 exhibits acid resistance...
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Applications
Adhesives
Polymers>Epoxies (EP)
LUCKAMIDE WN-620
DIC Corporation
LUCKAMIDE WN-620 by DIC Corporation is a modified aliphatic polyamine grade with high strength. Acts as a fast curing agent for room temperature epoxy resin. LUCKAMIDE WN-620 is used as an...
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Applications
Adhesives
Polymers>Epoxies (EP)
Megaface® EFS-131
DIC Corporation
Megaface® EFS-131 by DIC Corporation is PFAS-free, environment-friendly surfactant. It has a high surface tension reduction ability equal to or higher than that of fluorine-based products, and excellent uniform...
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Applications
Adhesives
Automotive
PHENOLITE LA-1356
DIC Corporation
PHENOLITE LA-1356 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Provides high heat-, moisture- and chemical resistance. It can be diluted in methyl ethyl...
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Applications
Adhesives>Solvent based adhesives
PHENOLITE LA-3018-50P
DIC Corporation
PHENOLITE LA-3018-50P by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Offers high heat-, moisture- and chemical resistance. It can be diluted in PGM solution...
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Applications
Adhesives>Solvent based adhesives
PHENOLITE LA-7052
DIC Corporation
PHENOLITE LA-7052 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. It can be diluted in methyl ethyl ketone. Offers high heat-, moisture- and chemical...
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Applications
Adhesives>Solvent based adhesives
PHENOLITE LA-7054
DIC Corporation
PHENOLITE LA-7054 by DIC Corporation is an ATN-type novolac phenol resin with high cross-linking density. Possesses high heat-, moisture- and chemical resistance. Shows compatibility with epoxy...
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Applications
Adhesives>Solvent based adhesives
PHENOLITE LA-7751
DIC Corporation
PHENOLITE LA-7751 by DIC Corporation is an ATN-type novolac phenol resin which exhibits high cross-linking density. Offers high heat-, moisture- and chemical resistance. Shows compatibility with...
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Applications
Adhesives>Solvent based adhesives
PHENOLITE TD-2090
DIC Corporation
PHENOLITE TD-2090 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Exhibits softening point at 117-123°C and high cross-linking density. Shows high heat-, moisture- and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
PHENOLITE TD-2091
DIC Corporation
PHENOLITE TD-2091 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Offers softening point at 105-115°C and high cross-linking density. Shows high heat-, moisture- and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
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